Stripping composition for a mold for making a composite material part, and method of preparing
View Patent ↗A stripping composition, and a method of making the stripping composition. The stripping composition including 100 parts by weight of a base ingredient consisting in epoxy polydimethylsiloxane, 0.5 to 10 parts by weight of a polymerization agent for polymerizing the base ingredient and constituted by a diaryliodonium salt, not more than 30 parts by weight of an anti-adhesion modulator constituted by a silicone polymer; and not more than 40 parts by weight of an anti-stick agent making the composition less tacky prior to polymerization and constituted by at least one vinyl ether compound.
1. A method of making a polymerizable stripping composition for coating a mold, said method comprising combining the following:
100 parts by weight of a base ingredient comprising a first epoxy polydimethylsiloxane;
0.5 to 10 parts by weight of a polymerization agent comprising a diaryliodonium salt for polymerizing said base ingredient;
5 to 10 parts by weight of an anti-adhesion modulator comprising a second epoxy polydimethylsiloxane, different from the first epoxy polydimethylsiloxane, the first and second epoxy polydimethylsiloxanes being from different products and the second epoxy polydimethylsiloxane having a higher viscosity than the first epoxy polydimethylsiloxane; and
an antistick agent comprising 8 to 12 parts by weight of dodecyl monovinyl ether compound and 8 to 12 parts by weight of cyclohexane dimethanol divinyl ether in the stripping composition to form a solvent-free polymerizable liquid stripping composition, said stripping composition being polymerizable by application of heat.
2. The method according to claim 1 , wherein said stripping composition is capable of being polymerized by heating at 150° C.±5° C. for 1 hour.
3. The method according to claim 1 , wherein said stripping composition is capable of being polymerized by heating at 100° C. for 30 minutes.
4. The method according to claim 1 , wherein said cyclohexane dimethanol divinyl ether in the antistick agent is 1,4 cyclohexane dimethanol divinyl ether.
5. A stripping composition obtained as per the method in claim 4 .
6. The method according to claim 1 , wherein said stripping composition comprises:
5 to 7 parts by weight of said polymerization agent; and
said antistick agent is obtained by mixing the dodecyl monovinyl ether compound with the cyclohexane dimethanol divinyl ether.
7. The method according to claim 1 , wherein said stripping composition comprises:
6 parts by weight of said polymerization agent;
8 parts by weight of said anti-adhesion modulator;
11.4 parts by weight of said dodecyl monovinyl ether; and
11.4 parts by weight of said cyclohexane dimethanol divinyl ether.
8. A stripping composition obtained as per the method in claim 1 .
9. The metal according to claim 1 wherein the first epoxy polydimethylsiloxane has a viscosity at 25° C. of 300 mm 2 /s and the second epoxy polydimethylsiloxane has a viscosity at 25° C. of 500 mm 2 /s.
10. The method of claim 1 wherein the first and second epoxy polydimethylsiloxanes together form a bimodal chain length distribution.
11. A heat polymerizable stripping composition comprising:
100 parts by weight of a base ingredient comprising a first epoxy polydimethylsiloxane;
0.5 to 10 parts by weight of a polymerization agent comprising a diaryliodonium salt for polymerizing said base ingredient;
5 to 10 parts by weight of an anti-adhesion modulator, said anti-adhesion modulator comprising a second epoxy polydimethylsiloxane the first and second epoxy polydimethylsiloxanes being from different products and the second epoxy polydimethylsiloxane having a higher viscosity than the first epoxy polydimethylsiloxane wherein the first and second epoxy polydimethylsiloxanes together form a bimodal chain length distribution; and
an antistick agent comprising 8 to 12 parts by weight of dodecyl monovinyl ether compound and 8 to 12 parts by weight of cyclohexane dimethanol divinyl ether in the stripping composition.
12. The composition of claim 11 wherein the first epoxy polydimethylsiloxane has a viscosity at 25° C. of 300 to mm 2 /s and the second epoxy polydimethylsiloxane having a viscosity at 25° C. of 600 mm 2 /s.
13. The composition of claim 11 wherein the composition consists essentially of the first epoxy polydimethylsiloxane, the diaryliodonium salt, the second epoxy polydimethylsiloxane, the dodecyl monovinyl ether, and cyclohexane dimethanol divinyl ether.
14. A stripping composition application system comprising:
a cloth pre-impregnated with a heat polymerizable liquid and solution-free stripping composition comprising:
100 parts by weight of a base ingredient comprising a first epoxy polydimethylsiloxane; 0.5 to 10 parts by weight of a polymerization agent comprising a diaryliodonium salt for polymerizing said base ingredient;
5 to 10 parts by weight of an anti-adhesion modulator, said anti-adhesion modulator comprising a second epoxy Polydimethylsiloxane; and
an antistick agent comprising 8 to 12 parts by weight of dodecyl monovinyl ether compound and 8 to 12 parts by weight of cyclohexane dimethanol divinyl ether in the stripping composition.
15. A method of applying a stripping composition to a mold, said method comprising:
providing a mold having a mold surface;
providing a heat polymerizable liquid and solvent-free stripping composition comprising:
100 parts by weight of a base ingredient comprising a first epoxy polydimethylsiloxane;
0.5 to 10 parts by weight of a polymerization agent comprising a diaryliodonium salt for polymerizing said base ingredient;
5 to 10 parts by weight of an anti-adhesion modulator, said anti-adhesion modulator comprising a second epoxy Polydimethylsiloxane; and
an antistick agent comprising 8 to 12 parts by weight of dodecyl monovinyl ether compound and 8 to 12 parts by weight of cyclohexane dimethanol divinyl ether in the stripping composition;
applying the stripping composition to the surface of the mold in a thickness on the order of one micrometer; and
heating the stripping composition to polymerize the stripping composition.
16. The method of claim 15 wherein the step of providing the stripping composition comprises providing a wipe pre-impregnated with the stripping composition, and the step of applying the stripping composition comprises hand wiping the wipe over the mold surface.
17. A stripping composition applicator comprising:
a wipe pre-impregnated with a stripping composition, the stripping composition comprising:
100 parts by weight of a base ingredient comprising a first epoxy polydimethylsiloxane;
0.5 to 10 parts by weight of a polymerization agent comprising a diaryliodonium salt for polymerizing said base ingredient;
5 to 10 parts by weight of an anti-adhesion modulator, said anti-adhesion modulator comprising a second epoxy polydimethylsiloxane; and
an antistick agent comprising 8 to 12 parts by weight of dodecyl monovinyl ether compound and 8 to 12 parts by weight of cyclohexane dimethanol divinyl ether in the stripping composition;
the polymerizable stripping composition being in a liquid form, solvent-free and curable by heat.
18. The applicator of claim 17 wherein the first and second epoxy polydimethylsiloxanes are from different products and the second epoxy polydimethylsiloxane has a higher viscosity than the first epoxy polydimethylsiloxane.
19. The composition of claim 17 wherein the first epoxy polydimethylsiloxane has a viscosity at 25° C. of 300 mm 2 /s and the second epoxy polydimethylsiloxane has a viscosity at 25° C. of 500 to 800 mm 2 /s.