Fluorine compounds for doping conductive oxide thin films

1. A method of forming a conductive fluorine-doped metal oxide layer on a substrate by chemical vapor deposition, the method comprising:

heating the substrate in a processing chamber;

introducing a metal-containing precursor, and a fluorine-containing precursor to the processing chamber; and

reacting the precursors to deposit the fluorine-doped metal oxide layer on the substrate;

wherein the fluorine-containing precursor is a hydrofluorinated ether having the formula;

R 1 —O—R2

wherein R 1 and R 2 are independently a C 1 -C 4 alkyl group which may have one or more hydrogens (—H) substituted with fluorine (—F) groups, and wherein if either R 1 or R 2 is an unsubstituted alkyl group with no fluorine groups, then the other group R 1 or R 2 has at least one hydrogen substituted with a fluorine group; and

wherein the hydrofluorinated ether is selected from the group consisting of C 3 F 7 OCH 3 , C 4 F 9 OCH 3 , C 4 F 9 OC 2 H 5 , CF 3 OCH 3 , CHF 2 OCHF 2 , CF 3 CF 2 OCH 3 , CF 3 OCHFCF 3 , and CF 3 COCBr 2 H.

2. The method of claim 1 , wherein the method further comprises introducing an oxygen-containing precursor to the processing chamber.

3. The method of claim 1 , wherein the fluorine-containing precursor is selected from the group consisting of Halocarbons 116, 1216, 14, 218, 23, 32, 41, 4110, and C318; C 2 BrF 3 , CH 3 F, CF 4 , CF 2 O, CHClF 2 , C 2 ClF 5 , C 2 ClF 3 , CClF 3 , CBr 2 F 2 , C 2 Br 2 F 4 , CCl 2 F 2 , CHCl 2 F, C 2 Cl 2 F 4 , C 2 H 3 ClF 2 , C 2 H 4 F 2 , C 2 H 2 F 2 , CH 2 F 2 , C 3 F 7 OCH 3 , C 3 F 6 O, C 2 F 6 , C 3 F 6 , C 4 F 8 , C 4 F 8 O, C 5 F 8 , C 2 H 5 F, C 4 F 10 , C 3 F 8 , C 2 F 4 , CCl 3 F, C 2 Cl 3 F 3 , CHF 3 , C 2 H 3 F, BF 3 , HF, F 2 , a mixture of F 2 and O 2 , F 2 O, F 3 NO, FNO, COF 2 , CF 3 NO, CF 3 OF, CF 3 I, SiF 4 , SF 6 , SF 4 , SClF 5 , SO 2 F 2 , S 2 F 10 , WF 6 , AsF 5 , GeF 4 , PF 3 , BrF 5 , BrF 3 , IF 5 , CIF 3 , NF 3 , N 2 F 4 , NCl 2 F, NF 2 Cl, ClF, BrF, ClFO 3 , ClF 3 , and XeF 2 .

4. The method of claim 1 , wherein the fluorine-containing precursor is a fluorine-and-tin-containing precursor selected from the group consist SnF 4 , SnCl 3 F, SnOF 2 , SnO(CF 3 ) 2 , wherein the tin comprises at least a portion of the metal in the fluorine-doped metal oxide layer deposited on the substrate.

5. The method of claim 1 , wherein the fluorine-containing precursor comprises a fluorine and oxygen-containing precursor.

6. The method of claim 5 , wherein the fluorine and oxygen-containing precursor comprises F 2 O.

7. The method of claim 6 , wherein the F2O provides at least a portion of the oxygen for the fluorine-doped metal oxide layer deposited on the substrate.

8. The method of claim 1 , wherein the metal-containing precursor comprises tin, indium, zirconium, cadmium, silicon, copper, lead, titanium, mercury, barium, or zinc.

9. The method of claim 1 , wherein the metal-containing precursor comprises an organo-tin compound.

10. The method of claim 9 , wherein the organo-tin compound is selected from the group consisting of tin tetrachloride and tetramethyltin.