Light emitting diode component
View Patent ↗In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
1. A lighting apparatus comprising:
a light source selected from a group consisting of (i) a single light emitting diode (LED) chip and (ii) a plurality of LED chips facing a same direction; and
a spherical surface spaced apart from and surrounding the light source, the spherical surface comprising phosphor configured to perform wavelength conversion of light emitted by the light source.
2. The lighting apparatus as set forth in claim 1 , wherein the spherical surface surrounding the light source comprises a sphere.
3. The lighting apparatus as set forth in claim 2 , wherein the light source is disposed at a center of the sphere.
4. The lighting apparatus as set forth in claim 3 , further comprising:
a pedestal passing through the sphere, the light source being disposed on an end of the pedestal inside the sphere.
5. The lighting apparatus as set forth in claim 4 , wherein the pedestal comprises a heat sink for heat sinking the light source.
6. The lighting apparatus as set forth in claim 1 , wherein the light source is a single LED chip.
7. The lighting apparatus as set forth in claim 6 , wherein the spherical surface surrounding the light source comprises a sphere.
8. The lighting apparatus as set forth in claim 7 , wherein the single LED chip is disposed at a center of the sphere.
9. The lighting apparatus as set forth in claim 8 , further comprising:
a pedestal passing through the sphere, the single LED chip being disposed on an end of the pedestal inside the sphere.
10. The lighting apparatus as set forth in claim 7 , further comprising:
a pedestal passing through the sphere, the single LED chip being disposed on an end of the pedestal inside the sphere.
11. The lighting apparatus as set forth in claim 10 , wherein the pedestal comprises a heat sink for heat sinking the single LED chip.
12. A lighting apparatus comprising:
a light source selected from a group consisting of (i) a single light emitting diode (LED) chip and (ii) a plurality of LED chips facing a same direction; and
a phosphor surface spaced apart from and surrounding the light source and spanning a solid angle of about 4π steradians around the light source, the phosphor surface comprising phosphor configured to perform wavelength conversion of light emitted by the light source.
13. The lighting apparatus as set forth in claim 12 , wherein the phosphor surface comprises a sphere and the light source is disposed at a center of the sphere.
14. The lighting apparatus as set forth in claim 12 , further comprising:
a pedestal passing through the phosphor surface, the light source being disposed on an end of the pedestal inside the phosphor surface.
15. The lighting apparatus as set forth in claim 12 , wherein the light source is a single LED chip.
16. A lighting apparatus comprising:
a single light emitting diode (LED) chip; and
a spherical phosphor surface spaced apart from and surrounding the single LED chip, the spherical phosphor surface spanning a solid angle of about 4π steradians around the single LED chip, the spherical phosphor surface comprising phosphor configured to perform wavelength conversion of light emitted by the single LED chip.
17. The lighting apparatus as set forth in claim 16 , wherein the single LED chip is disposed at a center of the spherical phosphor surface.
18. The lighting apparatus as set forth in claim 16 , further comprising:
a pedestal passing through the spherical phosphor surface, the single LED chip being disposed on an end of the pedestal inside the spherical phosphor surface.