DEPOSITION SOURCE AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DEVICE
A deposition source which improves deposition characteristics and uniformity of a deposited film, and a method of manufacturing an organic light-emitting device. The deposition source includes a heat source, a heat transfer plate arranged on the heat source and adapted to receive heat generated by and transferred from the heat source and a planarization layer arranged on the heat transfer plate, the heat source to supply more heat per unit area to outer portions of the heat transfer plate that surrounds a central portion of the heat transfer plate than to the central portion of the heat transfer plate.
1 . A deposition source, comprising:
a heat source;
a heat transfer plate arranged on the heat source and adapted to receive heat generated by and transferred from the heat source; and
a planarization layer arranged on the heat transfer plate, the heat source to supply more heat per unit area to outer portions of the heat transfer plate that surrounds a central portion of the heat transfer plate than to the central portion of the heat transfer plate.
2 . The deposition source of claim 1 , wherein the heat source comprises a coil portion.
3 . The deposition source of claim 2 , further comprising a power supply unit, wherein the coil portion is comprised of a single body that is connected to the power supply unit.
4 . The deposition source of claim 2 , further comprising a plurality of power supply units, wherein the coil portion is comprised of a corresponding plurality of subcoil portions, and wherein ones of the plurality of subcoil portions are connected to separate and independent ones of the plurality of power supply units.
5 . The deposition source of claim 2 , wherein the coil portion is more compactly arranged in positions corresponding to the outer areas of the heat transfer plate that surround central areas of the hat transfer plate and are less compactly arranged in positions corresponding to the central areas of the heat transfer plate.
6 . The deposition source of claim 4 , wherein ones of the plurality of subcoil portions of the coil portion are arranged throughout an entirety of the heat transfer plate at a uniform density.
7 . The deposition source of claim 2 , wherein the coil portion is comprised of an element selected from a group consisting of nickel and titanium.
8 . The deposition source of claim 1 , wherein the heat source comprises a heat pipe and a heat transfer fluid arranged within the heat pipe.
9 . The deposition source of claim 8 , the heat pipe being comprised of a plurality of coils, wherein ones of the coils of the heat pipe are more compactly arranged at locations corresponding to an outer portion of the heat transfer plate that surrounds a central portion of the heat transfer plate and are less compactly arranged at locations corresponding to the central portion of the heat transfer plate.
10 . The deposition source of claim 8 , wherein the heat pipe is comprised an element selected from a group comprising copper and aluminum.
11 . The deposition source of claim 8 , wherein the heat transfer fluid is comprised of a paraffin-based compound.
12 . The deposition source of claim 1 , wherein the heat transfer plate is comprised of a metal.
13 . The deposition source of claim I, wherein the planarization layer is separable from the heat transfer plate.
14 . The deposition source of claim 1 , wherein the planarization layer is comprised of an element selected from a group consisting of aluminum and copper.
15 . The deposition source of claim 1 , further comprising a heat blocking portion arranged to surround side surfaces of the heat transfer plate and the planarization layer.
16 . The deposition source of claim 15 , wherein portions of the heat blocking portion are arranged under the heat source.
17 . The deposition source of claim 15 , wherein the heat blocking portion comprises ceramic.
18 . The deposition source of claim 15 , wherein the heat blocking portion is comprised of at least one material selected from a group consisting of ZrO2, SiO2, and CaO.
19 . The deposition source of claim 1 , wherein a size of the planarization layer is larger than a size of a target on which the deposition material is to be deposited.
20 . A method of manufacturing an organic light-emitting device, comprising:
providing a deposition source that includes a heat source, a heat transfer plate arranged on the heat source to receive heat generated by and transferred from the heat source, and a planarization layer arranged on the heat transfer plate, the heat source to supply more heat per unit area of the heat transfer plate to outer portions of the heat transfer plate that surround a central portion of the heat transfer plate than to the central portion of the heat transfer plate;
preparing a substrate having a first electrode arranged thereon;
forming an organic light-emitting layer on the first electrode;
forming at least one organic layer arranged adjacent to the organic light-emitting layer; and
forming a second electrode electrically connected to the organic light-emitting layer, wherein the deposition source is used to produce at least one of the organic light-emitting layer and the at least one organic layer.
21 . The method of claim 20 , wherein the forming of the at least one of the organic light-emitting layer and the at least one organic layer via the deposition source comprises arranging the substrate to face the planarization layer.
22 . The method of claim 20 , wherein a size of the planarization layer is larger than a size of the substrate.
23 . The method of claim 20 , wherein the at least one organic layer comprises at least one layer selected from a group consisting of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.