Micro-structure phosphor coating

1. A method of fabricating an optical emitter, comprising:

attaching a light-emitting diode (LED) die to a package substrate;

electrically connecting the LED die and the package substrate;

applying a micro-structure phosphor coating precursor on the LED die, wherein the micro-structure phosphor coating comprises ultraviolet (UV) gel or thermal gel;

applying a micro-structure phosphor mold over the micro-structure phosphor coating precursor on the LED die to transfer a plurality of micro-structures onto the micro-structure phosphor coating precursor;

curing the micro-structure phosphor coating, wherein the curing comprises exposing the micro-structure phosphor coating precursor to ultraviolet (UV) light through the micro-structure phosphor mold; and

removing the micro-structure phosphor mold.

2. The method of claim 1 , wherein the curing a micro-structure phosphor coating comprises heating the micro-structure phosphor coating precursor.

3. The method of claim 1 , wherein the micro-structures have a pitch of about 10 to 50 microns.

4. The method of claim 1 , wherein the micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.

5. The method of claim 1 , further comprising applying a uniform coating precursor.

6. The method of claim 5 , wherein the uniform coating precursor includes phosphor material.

7. The method of claim 1 , wherein the applying the micro-structure phosphor mold comprises applying pressure to the micro-structure phosphor mold such that patterns on an underside of the micro-structure phosphor mold are transferred into the micro-structure phosphor coating precursor.

8. The method of claim 1 , applying the micro-structure phosphor mold comprises displacing a portion of the precursor into the micro-structure patterns.

9. The method of claim 1 , wherein the LED die has a growth substrate and a mesa structure disposed on a first side of the substrate, and wherein the micro-structure phosphor coating precursor is applied to a second side of the growth substrate opposite the first side.

10. A method of fabricating an optical emitter, comprising:

attaching a light-emitting diode (LED) die to a package substrate;

electrically connecting the LED die and the package substrate;

applying a micro-structure phosphor coating precursor on the LED die, wherein the micro-structure phosphor coating precursor comprises ultraviolet (UV) gel or thermal gel;

shaping the micro-structure phosphor coating precursor into a plurality of micro-structures via a molding apparatus; and

curing the micro-structure phosphor coating precursor.

11. The method of claim 10 , wherein the step of shaping includes applying a pressure to the molding apparatus to displace a portion of the micro-structure phosphor coating precursor on the LED die.

12. The method of claim 10 , wherein the phosphor coating precursor is a conformal layer on the surface of the LED die opposite from the package substrate.

13. The method of claim 10 , wherein a shape of the micro-structures are defined by an underside of the molding apparatus.

14. The method of claim 13 , wherein the micro-structures are pyramids.

15. The method of claim 14 , wherein the pyramids are three-sided.

16. The method of claim 10 , wherein the curing the patterned portion comprises exposing the micro-structure phosphor coating precursor to a radiation energy through the molding apparatus.

17. A method, comprising:

coupling a light-emitting diode (LED) die to a packaging substrate, the LED die include a growth substrate and a mesa structure disposed on a first side of the growth substrate;

forming a layer over a second side of the growth substrate, the layer containing a phosphor material;

molding the layer into a plurality of micro-structures through a molding apparatus, wherein an underside of the molding apparatus defines a shape of the molded micro-structures; and

curing the micro-structures.

18. The method of claim 17 , further comprising removing the molding apparatus after the curing.

19. The method of claim 17 , further comprising electrically coupling the LED die to the packaging substrate.

20. The method of claim 17 , further comprising a uniform coating precursor over the second side of the growth substrate, and wherein the forming the layer is performed such that the layer containing the phosphor material is formed over the uniform coating precursor.