Getter composition and organic light emitting diode device including the same

1. A getter composition, comprising;

a moisture absorbing material; and

a binder,

wherein the binder has a volatility of about 400 ppm or less when heated to a temperature in the range of 60° C. to 120° C. for 2 hours, and

the moisture absorbing material comprises at least one material selected from the group consisting of manganese (Mn), and manganese oxide thereof.

2. The getter composition of claim 1 , wherein the binder comprises a material selected from a group consisting of silicone resin, epoxy resin and a combination thereof.

3. The getter composition of claim 2 , wherein the binder comprises silicone resin, and the binder has a weight loss rate of 0.6 wt % or less when cured at a temperature in the range of 80° C. to 120° C.

4. The getter composition of claim 2 , wherein the binder comprises epoxy resin, and wherein the binder has a weight loss rate of 1 wt % or less when cured at a temperature in the range of 80 to 120° C.

5. The getter composition of claim 2 , wherein the getter composition is absent of a solvent.

6. The getter composition of claim 1 , wherein the moisture absorbing material has a particle size in the range of 10 nm to 500 nm.

7. The getter composition of claim 6 , wherein the moisture absorbing material has an average particle size in the range of 150 nm to 250 nm.

8. The getter composition of claim 1 , wherein the moisture absorbing material and the binder comprise in an amount of 20 wt % to 80 wt % respectively based on the entire amount of the getter composition.

9. The getter composition of claim 1 , wherein the getter composition is a liquid.

10. An organic light emitting diode device, comprising:

a first substrate and a second substrate;

an organic emission layer arranged between the first substrate and the second substrate; and

a getter arranged between the first substrate and the second substrate, wherein:

the getter comprises a moisture absorbing material and a binder having a volatility of about 400 ppm or less when heated to a temperature in the range of 60° C. to 120° C. for 2 hours;

the moisture absorbing material comprises at least one material selected from the group consisting of manganese (Mn), iron (Fe), and oxides thereof; and

the getter is further arranged at a location that overlaps the organic emission layer.

11. The organic light emitting diode device of claim 10 , wherein the binder comprises a silicone resin and has a weight loss of 0.6 wt % or less at a temperature in the range of 80° C. to 120° C.

12. The organic light emitting diode device of claim 11 , wherein the moisture absorbing material has a particle size in the range of 10 nm to 500 nm.

13. The organic light emitting diode device of claim 12 , wherein the moisture absorbing material has an average particle size in the range of 150 nm to 250 nm.

14. The organic light emitting diode device of claim 12 , further comprising a sealing member arranged between the first substrate and the second substrate to attach and fix the first substrate to the second substrate, the getter being arranged between the organic emission layer and the sealing member.

15. The organic light emitting diode device of claim 13 , further comprising a sealing member arranged between the first substrate and the second substrate to attach and fix the first substrate to the second substrate, the getter being surrounded by the sealing member.

16. The organic light emitting diode device of claim 10 , wherein the binder comprises a material selected from a group consisting of silicone resin, epoxy resin and a combination thereof.

17. The organic light emitting diode device of claim 16 , wherein the binder comprises an epoxy resin and has a weight loss of 1 wt % or less at a temperature in the range of 80° C. to 120° C.

18. The organic light emitting diode device of claim 17 , wherein the binder is absent of a solvent.