IP Library Granted Patent US 8,480,448
Granted Patent B2
US 8,480,448 · App. 12/890,226 · Granted Jul 9, 2013

Donor film for laser induced thermal imaging method, light emitting device using the same, and method of manufacturing light emitting device

Inventors: Nam-Choul Yang (Yongin-si, KR); Lian Duan (Yongin-si, KR); Mu-Hyun Kim (Yongin-si, KR); Seong-Taek Lee (Yongin-si, KR)
Assignee: Samsung Display Co., Ltd.
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Quick Facts
Patent No.
US 8,480,448
App. No.
12/890,226
Granted
Jul 9, 2013
Kind
B2
Abstract

A donor film for a laser induced thermal imaging method capable of improving the optical efficiency of an emission layer, a light emitting device using the same, and a method of manufacturing the light emitting device are provided. The donor film for a laser induced thermal imaging method includes a base substrate, a light to heat conversion layer (LTHC) provided on the base substrate and having a pattern with a predetermined step difference, and a transfer layer provided on the LTHC. It is possible to improve the optical efficiency of the emission layer by patterning the transfer layer using the LTHC having the pattern with a predetermined step difference.

Claims (15)

1. A method of manufacturing a light emitting device, the method comprising the steps of:

providing an acceptor substrate;

providing a donor film separated from said acceptor substrate by a predetermined distance and comprising a light to heat conversion layer including a transcription pattern with a predetermined step difference on a base substrate and a transfer layer provided on said light to heat conversion layer including the transcription pattern;

arranging said donor film so that said transfer layer faces the surface of said acceptor substrate; and

radiating a laser onto said donor film to transcribe the transfer layer onto said acceptor substrate.

2. The method as claimed in claim 1 , before the step of transcribing said transfer layer, further comprising forming a first electrode on the acceptor substrate.

3. The method as claimed in claim 2 , further comprising:

forming an active layer on said first electrode; and

forming a second electrode on said active layer.

4. The method as claimed in claim 1 , after the step of transcribing said transfer layer on the acceptor substrate, further comprising forming a first electrode on said transfer layer.

5. The method as claimed in claim 4 , further comprising:

forming an active layer on said first electrode; and

forming a second electrode on said active layer.

6. The method as claimed in claim 1 , wherein the step of transcribing said transfer layer includes transcribing protruding parts of said transfer layer first.

7. The method as claimed in claim 6 , wherein said pattern is a concavo-convex pattern or an embossed pattern.

Assignments (1)
DIVESTITURE Recorded Sep 21, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029070/0516 →
Priority Claims (1)
KR 10-2005-0083889 · Sep 8, 2005 · national
Continuity (2)
Division 11517481 · Sep 8, 2006
Related Publication 20110014729A1 · Jan 20, 2011