Heat management in an electronic module
View Patent ↗In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are configured and arranged for movement independent of each other. At least two retention elements are configured to bias a respective heat sink element against any electronic module that is positioned within the module guide.
1. A heat management system comprising:
a module guide configured to receive a single pluggable electronic module;
at least two heat sink elements configured and arranged for movement independent of each other, each heat sink element having a substantially planar surface on one side of the heat sink element and a plurality of extended surfaces on another side of the heat sink element, a first one of the heat sink elements abutting a second one of the heat sink elements; and
at least two retention elements configured to bias the substantially planar surfaces of the at least two heat sink elements against a single substantially planar surface of the single pluggable electronic module when the pluggable electronic module is positioned within the module guide.
2. The heat management system as recited in claim 1 , wherein the module guide comprises a pair of rails.
3. The heat management system as recited in claim 2 , wherein each rail comprises:
a plurality of fingers each configured to engage with a host board of a host device in order to attach the rail of the module guide to the host board; and
a plurality of hooks each configured to engage with a retention element in order to attach the retention element to the rail of the module guide.
4. The heat management system as recited in claim 3 , wherein each retention element comprises a clip.
5. The heat management system as recited in claim 4 , wherein each clip is shaped from a wire having a substantially circular cross section and is configured to engage a hook on both of the rails.
6. The heat management system as recited in claim 4 , wherein the at least two heat sink elements comprise seven heat sink elements.
7. The heat management system as recited in claim 2 , wherein each retention element comprises a clip integrally formed with one of the rails.
8. The heat management system as recited in claim 7 , wherein each heat sink element includes a pair of protrusions each configured to engage one of the clips such that the pair of engaged clips bias the heat sink element against a portion of any electronic module that is positioned within the module guide.
9. The heat management system as recited in claim 2 , wherein the plurality of extended surfaces are uniformly distributed across the heat sink elements without variation at any seam between two heat sink elements.
10. The heat management system as recited in claim 1 , wherein the heat sink elements bias directly against the pluggable electronic module without intervening thermally conductive interface material.
11. The heat management system as recited in claim 1 , wherein each of the heat sink elements abuts at least another of the heat sink elements.
12. The heat management system as recited in claim 11 , wherein no portion of the module guide is positioned between any two abutting heat sink elements.
13. The heat management system as recited in claim 11 , wherein the abutting heat sink elements cooperate to form a substantially gapless covering of any electronic module that is positioned within the module guide.
14. The heat management system as recited in claim 1 , wherein the module guide defines only a single opening that enables the substantially planar surfaces of the heat sink elements to bias against the single substantially planar surface of any pluggable electronic module that is positioned within the module guide.
15. The heat management system as recited in claim 1 , wherein a length of each of the sink elements is positioned substantially perpendicular to a length of any electronic module that is positioned within the module guide, where length is greater than width.