IP Library Granted Patent US 8,531,348
Granted Patent B2
US 8,531,348 · App. 12/894,191 · Granted Sep 10, 2013

Electronic device with embedded antenna

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Quick Facts
Patent No.
US 8,531,348
App. No.
12/894,191
Granted
Sep 10, 2013
Kind
B2
Abstract

An electronic device with an embedded three-dimensional antenna is disclosed. The electronic device includes a printed circuit board (PCB) and an embedded three-dimensional antenna. The embedded three-dimensional antenna includes a radiation element and a connection element. The connection element includes a first connection part and a second connection part. The first and second connection parts are coupled to the PCB, and utilized for transferring signals of the embedded three-dimensional antenna to the PCB. The first and second connection parts further clamp the PCB to attach the embedded three-dimensional antenna on the PCB.

Claims (15)

1. An electronic device with an embedded antenna, the electronic device comprising:

a Printed Circuit Board (PCB), comprising a through hole and a metal contact, the through hole and the metal contact forming a first antenna assembly area; and

an embedded antenna, comprising:

a radiation element; and

a first connection element, forming a Π (pi) shape mechanism, the Π shape mechanism comprises a first connection part, a second connection part and a third connection part, the first connection part and the third connection part forming one leg of the Π shape mechanism, respectively, the third connection part coupled to the radiation element and parallel with a lateral of the PCB, the first connection part inserted into the through hole, the second connection part parallel with the PCB and jointed with the metal contact.

2. The electronic device of claim 1 , wherein the first connection element is attached on the first antenna assembly area of the PCB and the radiation element is parallel with the lateral of the PCB.

3. The electronic device of claim 2 , wherein the second connection part is a feeding terminal of the embedded antenna or a grounding terminal of the embedded antenna.

4. The electronic device of claim 2 , wherein an aperture of the through hole approximates to a size of the first connection part.

5. The electronic device of claim 1 , wherein the first connection element is assembled with the first antenna assembly area through Surface Mount Technology (SMT).

6. The electronic device of claim 1 , wherein the first antenna assembly area is adjacent to the lateral of the PCB.

7. The electronic device of claim 1 , wherein the PCB further comprises a second antenna assembly area, the embedded antenna further comprises a second connection element, and the second connection element is assembled with the second antenna assembly area through SMT.

8. The electronic device of claim 7 , wherein the second connection element also forms a Π shape mechanism.

9. The electronic device of claim 1 , wherein the embedded antenna is formed by a single sheet metal.

10. The electronic device of claim 1 , wherein the embedded antenna is a Planar Inverted-F Antenna (PIFA).

11. The electronic device of claim 1 , wherein the embedded antenna is a monopole antenna.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2021
From: MEDIATEK INC.
To: XUESHAN TECHNOLOGIES INC.
Reel/Frame 055486/0870 →
MERGER (RESUBMISSION OF THE MISSING MERGER DOCUMENTS FOR RESPONSE TO DOC ID:502887510) EFFECTIVE DATE:04/01/2014. WE ATTACHED THE MERGER DOCUMENTS ON JULY 11,2014. PLEASE REVIEW THE FILES AND REVISE THE DATE OF RECORDATION AS JULY 11, 2014. Recorded Jul 11, 2014
From: RALINK TECHNOLOGY CORP.
To: MEDIATEK INC.
Reel/Frame 033471/0181 →