Dual sided optical storage media and method for making same

1. An optical storage medium comprising:

a substrate disk having a first data pattern embossed in a major side thereof;

a first reflective layer formed over the embossed substrate data pattern and configured to be read through the substrate disk;

a first intermediate layer disposed on the first reflective layer opposite the substrate disk;

a second reflective layer disposed on the first intermediate layer opposite the first reflective layer, the second reflective layer having a second data pattern formed in a major surface thereof and being configured to be read from a direction opposite the substrate disk; and

a cover layer formed over the second reflective layer opposite the first intermediate layer having an exposed outer surface opposite the second reflective layer, wherein

the substrate disk has a thickness within a range of about 1.1 mm to 1.3 mm, the first intermediate layer has a thickness of about 20 μm, and the cover layer has a thickness within a range of 97 μm to 103 μm.

2. The optical storage medium of claim 1 , wherein the first data pattern is readable by a laser having a wavelength within a range of 770 nm to 790 nm and the second data pattern is readable by a laser having a wavelength within a range of 400 nm to 410 nm.

3. The optical recording medium of claim 1 , wherein at least one of the first data pattern and the second data pattern is configured to enable writing information to the optical recording medium.

4. The optical recording medium of claim 1 , further comprising: a hard coat layer formed over the exposed outer surface of the cover layer, the hard coat layer having an exposed outer surface opposite the cover layer.

5. The optical recording medium of claim 1 , further comprising: a barrier layer disposed over a second major side of the substrate disk opposite the embossed first data pattern.

6. An optical storage medium comprising:

a substrate disk having a first data pattern embossed in a major side thereof;

a first reflective layer formed over the embossed substrate data pattern and configured to be read through the substrate disk;

a first intermediate layer disposed on the first reflective layer opposite the substrate disk;

a second reflective layer disposed on the first intermediate layer opposite the first reflective layer, the second reflective layer having a second data pattern formed in a major surface thereof and being configured to be read from a direction opposite the substrate disk;

a cover layer formed over the second reflective layer opposite the first intermediate layer having an exposed outer surface opposite the second reflective layer;

a second intermediate layer formed over the second reflective layer opposite the first intermediate layer, the second intermediate layer including a third data pattern disposed on a major side of the second intermediate layer facing away from the second reflective layer; and

a third reflective layer disposed on the second intermediate layer opposite the first reflective layer and being configured to be read from the direction opposite the substrate disk, wherein

the cover layer is formed on the third reflective layer opposite the second intermediate layer and has an exposed outer surface opposite the third reflective layer.

7. The optical recording medium of claim 6 , wherein the substrate disk has a thickness within a range of about 1.1 mm to 1.3 mm, the first intermediate layer has a thickness of about 20 μm, the second intermediate layer has a thickness within a range of 20 μm to 30 μm and the cover layer has a thickness within a range of 72 μm to 78 μm.

8. A method for manufacturing an optical storage medium comprising the steps of:

forming a substrate disk including a first data pattern embossed in a major side thereof;

applying a first reflective layer over the first data pattern, the first reflective layer being configured to be read through the substrate disk;

applying an unhardened first resin material to the first reflective layer opposite the substrate disk;

contacting the unburdened first resin material with a reverse second data pattern of a first stamper;

hardening the first resin material about the reverse second data pattern to form a first intermediate layer including a second data pattern corresponding to the reverse second data pattern of the first stamper;

applying a second reflective layer over the second data pattern, the second reflective layer being configured to be read from a direction opposite the substrate disk; and

applying a cover layer over the second reflective layer opposite the first intermediate layer, the cover layer having an exposed outer surface opposite the second reflective layer,

wherein the substrate disk has a thickness within a range of about 1.1 mm to 1.3 mm, the first intermediate layer has a thickness of about 20 μm, and the cover layer has a thickness within a range of 97 μm to 103 μm.

9. The method of claim 8 , further comprising the step of:

applying a hard coat layer over the exposed outer surface of the cover layer, the hard coat layer having an exposed outer surface opposite the cover layer.

10. The method of claim 8 , wherein the first data pattern is readable by a laser having a wavelength within a range of 770 nm to 790 nm and the second data pattern is readable by a laser having a wavelength within a range of 400 nm to 410 mm.

11. The method of claim 8 , wherein the substrate disk is formed by an injection molding process using a substrate stamper having a reverse first data pattern formed thereon corresponding to the first data pattern.

12. The method of claim 8 , wherein the first reflective layer and second reflective layer are formed by a sputtering process.

13. A method for manufacturing an optical storage medium comprising the steps of:

forming a substrate disk including a first data pattern embossed in a major side thereof;

applying a first reflective layer over the first data pattern, the first reflective layer being configured to be read through the substrate disk;

applying an unhardened first resin material to the first reflective layer opposite the substrate disk;

contacting the unburdened first resin material with a reverse second data pattern of a first stamper;

hardening the first resin material about the reverse second data pattern to form a first intermediate layer including a second data pattern corresponding to the reverse second data pattern of the first stamper;

applying a second reflective layer over the second data pattern, the second reflective layer being configured to be read from a direction opposite the substrate disk;

applying a cover layer over the second reflective layer opposite the first intermediate layer, the cover layer having an exposed outer surface opposite the second reflective layer;

applying an unhardened second resin material to the second reflective layer opposite the first intermediate layer;

contacting the unhardened second resin material with a reverse third data pattern of a second stamper;

hardening the second resin material about the reverse third data pattern to form a second intermediate layer including a third data pattern corresponding to the reverse third data pattern of the second stamper; and

applying a third reflective layer over the third data pattern, the third reflective layer being configured to be read from the direction opposite the substrate disk, wherein

the cover layer is formed over the third reflective layer opposite the second intermediate layer and has an exposed outer surface opposite the third reflective layer.

14. The method of claim 13 , wherein the substrate disk has a thickness within a range of about 1.1 mm to 1.3 mm, the first intermediate layer has a thickness of about 20 μm, the second intermediate layer has a thickness within a range of 20 μm to 30 μm and the cover layer has a thickness within a range of 72 μm to 78 μm.