IP Library › Granted Patent US 8,123,110
Granted Patent B2
US 8,123,110 · App. 12/897,249 · Granted Feb 28, 2012

Method for soldering with a multistep temperature profile

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Quick Facts
Patent No.
US 8,123,110
App. No.
12/897,249
Granted
Feb 28, 2012
Kind
B2
Abstract

A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.

Claims (13)

1. A method for soldering a component via a solder material, comprising:

heating the component using a first temperature plateau for a first time duration such that the solder material is completely melted;

heating the component using a second temperature plateau for a second time duration, a temperature of the second temperature plateau is at least 90° C. lower than a temperature of the first temperature plateau;

heating the component using a third temperature plateau for a third time duration, a temperature of the third temperature plateau is lower than a temperature of the second temperature plateau; and

heating the component using a fourth temperature plateau for a fourth time duration, a temperature of the fourth temperature plateau is lower than a temperature of the third temperature plateau.

2. The method as claimed in claim 1 , wherein the temperature of the second temperature plateau is 100° C. below the temperature of the first temperature plateau.

3. The method as claimed in claim 1 , wherein the temperature of the third temperature is 15° C. lower than a temperature of the second temperature plateau.

4. The method as claimed in claim 1 , wherein the temperature of the third temperature is at least 20° C. lower than a temperature of the second temperature plateau.

5. The method as claimed in claim 1 , wherein the soldering is performed in a substrate of the component via a soldering insert.

6. The method as claimed in claim 1 , wherein the first time duration is 2 hours.

7. The method as claimed in claim 1 , wherein the second time duration is 2-4 hours.

8. The method as claimed in claim 7 , wherein the second time duration is 4 hours.

9. The method as claimed in claim 1 , wherein the fourth time duration is four 12-20 hrs.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2021
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS ENERGY GLOBAL GMBH & CO. KG
Reel/Frame 055875/0520 →