IP Library Granted Patent US 8,256,298
Granted Patent B2
US 8,256,298 · App. 12/900,398 · Granted Sep 4, 2012

MEMS pressure sensor

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Quick Facts
Patent No.
US 8,256,298
App. No.
12/900,398
Granted
Sep 4, 2012
Kind
B2
Abstract

A MEMS pressure sensor for sensing the pressure in a sealed cavity of a MEMS device, comprises a resonant MEMS device having a pressure sensor resonator element which comprises an array of openings. The resonant frequency of the resonant MEMS device is a function of the pressure in the cavity, with resonant frequency increasing with pressure. Over the pressure range 0 to 0.1 kPa, the average change in frequency is at least 10 −6 /Pa. The invention is based on the recognition that for fast oscillation, the elastic force causes the resonance frequency to shift. Therefore, it is possible to sense the pressure by a device with resonance frequency that is sensitive to the pressure.

Claims (17)

1. A MEMS pressure sensor for sensing the pressure in the vicinity of a MEMS device, comprising:

a monolithic resonant MEMS device having a pressure sensor resonator element which comprises an array of openings, wherein the resonant frequency of the resonant MEMS device is a function of the pressure in the vicinity of the pressure sensor with resonant frequency increasing with pressure, such that over the pressure range 0 to 0.1 kPa, the average relative change in frequency is at least 10 −6 /Pa.

2. A pressure sensor as claimed in claim 1 , wherein the openings of the pressure sensor resonator element have a maximum opening dimension in the range 0.2 μm to 1 μm.

3. A pressure sensor as claimed in claim 1 , wherein the openings of the pressure sensor resonator element have an average pitch in the range 5 μm to 20 μm.

4. A pressure sensor as claimed in claim 1 , wherein the pressure sensor resonator element has a thickness in the range 1 μm to 3 μm and an area in the range 100 μm 2 to 40,000 μm 2 .

5. A pressure sensor as claimed in claim 1 , wherein over the pressure range 0 to 0.01 kPa, the average relative change in frequency is at least 10 −6 /Pa, preferably over the pressure range 0 to 0.001 kPa the average change in frequency is at least 10 −6 /Pa.

6. A pressure sensor as claimed in claim 1 , wherein over the pressure range 0 to 10 −5 kPa, the Q factor decreases monotonically with increasing pressure.

7. A pressure sensor as claimed in claim 1 , further comprising means for measuring an electrical resistance of the pressure sensor resonator element to function as a Pirani element.

8. A pressure sensor as claimed in claim 1 , wherein the resonant frequency is read out by piezo-resistive, capacitive or optical sensing methods.

9. A pressure sensor as claimed in claim 1 further comprising a PLL oscillator for tracking the resonant frequency and/or phase with changing pressure.

10. A pressure sensor as claimed in claim 1 , wherein the pressure sensor resonator element ( 40 ) is in an open chamber for sensing ambient pressure in the vicinity of the chamber.

11. A MEMS device comprising a resonant device MEMS element within an encapsulated cavity and a pressure sensor as claimed in claim 1 for measuring the cavity pressure.

12. A device as claimed in claim 11 , wherein a single MEMS resonator element is controlled to vibrate in a lateral mode to function as the device resonator element, and is controlled to vibrate in a vertical resonant mode to function as the pressure sensor resonant element.

13. A device as claimed in claim 12 , wherein the resonator element when controlled to vibrate in a lateral mode comprises a bulk mode resonator functioning as a timing device or frequency reference.

14. A method of measuring a pressure below 0.1 kPa in the vicinity of a MEMS device, comprising:

monitoring the resonant frequency of a monolithic resonant MEMS device having a pressure sensor resonator element which comprises an array of openings, wherein the resonant frequency of the resonant MEMS device is a function of the pressure in the cavity with resonant frequency increasing with pressure, such that over the pressure range 0 to 0.1 kPa, the average relative change in frequency is at least 10 −6 /Pa.

15. A method of determining a defect in a MEMS device having a sealed cavity, comprising measuring the pressure in the sealed cavity using the method of claim 14 .

Assignments (13)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: AMS AG; AMS INTERNATIONAL AG; AMS SENSORS UK LIMITED; AMS SENSORS GERMANY GMBH
To: SCIOSENSE B.V.
Reel/Frame 052769/0820 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: NXP B.V.
To: AMS INTERNATIONAL AG
Reel/Frame 036015/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2011
From: SUIJLEN, MATTHIJS; KONING, JAN JACOB; BEIJERINCK, HERMAN COENRAAD WILLEM
To: NXP B.V.
Reel/Frame 025680/0850 →