FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER
Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features.
1 . A method of mounting an antenna wire to a surface of a substrate for a transponder chip comprising:
forming a channel in the surface of the substrate for accepting the antenna wire;
laying a self-bonding antenna wire into the channel; and
while laying the antenna wire into the channel, performing one or more of thermally or electrically warming the wire, or activating an adhesive layer of the wire by chemically.
2 . The method of claim 1 , wherein:
the channel is formed by laser ablation of the substrate material.
3 . The method of claim 2 , wherein:
the substrate is frozen during performing laser ablation.
4 . The method of claim 2 , wherein:
the substrate comprises a polymer material.
5 . The method of claim 2 , wherein:
the substrate comprises a porous material.
6 . The method of claim 2 , wherein:
the substrate comprises a non-porous material.
7 . The method of claim 2 , wherein:
the substrate comprises Teslin™.
8 . The method of claim 2 , wherein:
the channel is formed with a single pass of a laser.
9 . The method of claim 2 , wherein:
the channel is formed with multiple passes with a laser.
10 . The method of claim 1 , wherein
the channel is U-shaped.
11 . The method of claim 1 , wherein:
the channel is formed by a mechanical tool, or by a hot mold process.
12 . The method of claim 1 , wherein:
the channel has a depth which is less than a diameter of the wire, and as the wire is laid down into the channel, it is pressed further into the substrate.
13 . The method of claim 1 , wherein:
the channels are formed by removing material from the substrate.
14 . The method of claim 1 , further comprising:
forming a recess to receive a chip module in the substrate.
15 . The method of claim 14 , wherein:
the recess is formed by laser ablation of substrate material.
16 . The method of claim 14 , wherein:
the recess is a stepped recess.
17 . The method of claim 14 , wherein:
the channel extends from an edge of the recess.
18 . A method of forming an inlay substrate, comprising:
thinning an edge region of an inlay substrate using laser ablation.
19 . The method of claim 18 , further comprising:
forming studs for inserting into holes of a separate element in the thinned edge region.
20 . The method of claim 18 , further comprising:
forming holes for receiving studs of a separate element in the thinned edge region.