Semiconductor device including a MOSFET and a Schottky junction

1. A semiconductor device including a MOSFET, comprising:

a semiconductor substrate having a main surface and a back surface opposite to the main surface;

a plurality of transistor cell regions disposed in the semiconductor substrate,

each of the plurality of transistor cell regions including:

a plurality of trenches disposed on the main surface of the semiconductor substrate,

a well region in which a channel of the MOSFET is formed, disposed between the plurality of trenches,

a gate insulating film of the MOSFET disposed in each of the plurality of trenches,

a gate electrode of the MOSFET disposed over the gate insulating film in each of the plurality of trenches, and

a source region of the MOSFET disposed in the well region;

a source electrode of the MOSFET disposed over the main surface of the semiconductor substrate and being in contact with a top surface of the source region in each of the plurality of transistor cell regions,

a drain electrode of the MOSFET disposed over the back surface of the semiconductor substrate and electrically connected to the semiconductor substrate; and

a Schottky cell region disposed between the plurality of transistor cell regions in the semiconductor substrate,

the source electrode being in contact with a part of the main surface of the semiconductor substrate so as to form a Schottky junction in the Schottky cell region, and

the Schottky junction being located lower than a top surface of the source region.

2. A semiconductor device according to claim 1 ,

wherein the semiconductor substrate and the source region have a first conductivity type,

the well region has a second conductivity type which is opposite to the first conductivity type.

3. A semiconductor device according to claim 2 ,

wherein the first and second conductivity types are n-type and p-type, respectively.

4. A semiconductor device according to claim 3 ,

wherein the semiconductor substrate includes phosphorous.

5. A semiconductor device according to claim 1 ,

wherein a plurality of field insulating films are disposed on the main surface of the semiconductor substrate in the Schottky cell region,

the source electrode is partially located over the field insulating films, and

the Schottky junction is formed between the field insulating films.

6. A semiconductor device according to claim 1 ,

wherein the source electrode is comprised of aluminum.