Dithered scanned laser beam for scribing solar cell structures
View Patent ↗Provided herein are methods of scribing a solar cell structure to create isolated solar cells. The methods involve scanning and high frequency dithering of a laser beam across a solar cell structure such that the beam creates a stepped scribed line profile. In certain embodiments, a structure including an absorber layer sandwich between two contact layers is provided. The scanned dithered laser beam ablates all of these layers on one part of the scribe line while the back contact layer on another part of the scribe line, leaving an exposed back contact layer. The scribe electrically isolates solar cell structures on either side of the scribe line from each other, while providing a contact point to the back contact layer of one of solar cell structure for subsequent cell-cell interconnection.
1. A method of forming a monolithically integrated thin film photovoltaic cell, the method comprising:
providing a substrate having thin film photovoltaic materials deposited thereon,
identifying a scribe line across the substrate;
scanning a dithered laser beam along the scribe line to form electrically unconnected photovoltaic cells on either side of the scribe line, wherein a scribed line profile formed by scanning the dithered laser beam is stepped.
2. The method of claim 1 wherein scanning the dithered laser beam across the substrate comprises ablating the thin film photovoltaic materials completely to leave an insulative layer exposed along a first portion of the scribe line; and ablating the thin film photovoltaic materials to leave a conductive thin film layer exposed along a second portion of the scribe line, wherein said first and second portions are substantially parallel with the scribe line.
3. The method of claim 2 wherein said first and second portions are substantially co-extensive with the scribe line.
4. The method of claim 1 wherein the photovoltaic cells each comprise a back electrical contact layer, an absorber layer and a top electrical contact layer.
5. The method of claim 3 wherein the stepped scribed line profile is defined by a substantially vertical first sidewall including the back electrical contact layer, the absorber layer and the top electrical contact layer; a bottom including an insulative layer; a step including the back contact layer; and a substantially vertical second sidewall extending from the back contact step and including the absorber layer and the top electrical contact layer.
6. The method of claim 4 wherein the back contact layer is selected from the group consisting of molybdenum, chromium, niobium, copper, titanium, and zirconium.
7. The method of claim 1 wherein the absorber layer is selected from the group consisting of CIGS, CIS, CZTS, CdTe, and a-Si.
8. The method of claim 1 further comprising varying at least one dither parameter across the width of the scribe line.
9. The method of claim 8 wherein the at least one dither parameter comprises frequency, direction or amplitude of a dither motion path.
10. The method of claim 1 further comprising varying at least one laser operating parameter across the width of the scribe line.
11. The method of claim 10 wherein the at least one laser operating parameter comprises a laser pulse repetition rate.
12. The method of claim 10 wherein the at least one laser operating parameter comprises a laser energy per pulse.
13. The method of claim 10 wherein the at least one laser operating parameter comprises a laser beam dwell time.
14. The method of claim 10 wherein the at least one laser operating parameter comprises a laser intensity.
15. The method of claim 1 further comprising forming a conductive path between the photovoltaic cells on either side of the scribe line.
16. The method of claim 1 wherein the length of the scribe line is at least 0.5 m.
17. The method of claim 1 wherein the stepped scribed line profile is formed in a single pass of the laser beam across the substrate.
18. The method of claim 1 wherein scanning a dithered laser beam comprises sensing laser beam position relative to the scribe line width.
19. The method of claim 1 wherein the laser beam is dithered via a piezo-actuated scanner.
20. The method of claim 19 wherein the laser beam is scanned via a galvo scanner.