Electronic device and circuit board
View Patent ↗According to one embodiment, an electronic device includes a circuit board housed in a housing. The circuit board further includes a conductive layer, an insulating layer and a signal line. The conductive layer includes a base portion including a surface, a plurality of first projecting portions formed integrally with the base portion and extending in parallel with each other on the surface of the base portion, and a plurality of second projecting portions formed integrally with the base portion and extending in parallel with each other to cross the plurality of first projecting portions. The insulating layer is stacked on the conductive layer to cover the surface of the base portion, and the signal line is stacked on the insulating layer and extends in a direction crossing directions in which the first and second projecting portions extend.
1. An electronic device comprising:
a circuit board housed in a housing, the circuit board comprising an electronic part mounted thereon and provided with a hole at a position covered by the electronic part, the circuit board comprising:
a conductive layer comprising a base portion, a first projecting portion extending along a surface of the base portion, and a second projecting portion extending along the surface of the base portion to cross the first projecting portion;
an insulating layer stacked on the conductive layer; and
a signal line portion stacked on the insulating layer and extending in a direction crossing directions in which the first and second projecting portions extend, wherein
the hole is made through the insulating layer and the conductive layer, and the conductive layer further comprises a heat conducting portion facing the hole and being thicker than the base portion.
2. The electronic device of claim 1 , wherein the first and second projecting portion each extend in a direction diagonally crossing an edge portion of the circuit board.
3. The electronic device of claim 1 , wherein the first and second projecting portion of the conductive layer each extend from one of the edge portions to another one of the edge portions of the circuit board.
4. The electronic device of claim 2 , wherein the second projecting portion extends in a direction crossing at an angle 15 degrees with respect to the edge portion of the circuit board.
5. The electronic device of claim 1 , wherein the first and second projecting portions are formed by carrying out half-etching on a copper foil material which gives rise to the conductive layer.
6. The electronic device of claim 1 , wherein the insulating layer is overlaid on the conductive layer while tightly attaching to the base portion, the first projecting portion and the second projecting portion.
7. The electronic device of claim 4 , wherein the signal line portion extends in the direction at an angle of 0, 45, 90 or 135 degree with respect to the edge portion of the circuit board.
8. The electronic device of claim 1 , wherein the circuit board further includes a stack layer portion stacking on the insulating layer and the signal line portion, and
the circuit board is provided with an interlayer connection via configured to electrically connect a top portion of the first and/or second projecting portions of the conductive layer and the stacking layer portion to each other.
9. The electronic device of claim 8 , wherein the interlayer connection via is formed by filling a hole which is made through the insulating layer with a conductive paste.
10. A circuit board comprising:
a mounting surface mounted with an electronic part, and making a hole at a position covered by the electronic part;
a conductive layer comprising a base portion, a first projecting portion extending along a surface of the base portion, and a second projecting portion extending along the surface of the base portion to cross the first projecting portion;
an insulating layer stacked on the conductive layer; and
a signal line portion stacked on the insulating layer and extending in a direction crossing directions in which the first and second projecting portions extend, wherein
the hole is made through the insulating layer and the conductive layer, and the conductive layer comprises a heat conducting portion facing the hole and being thicker than the base portion.