Thin film deposition apparatus

1. A thin film deposition apparatus for forming a thin film on a substrate, the apparatus comprising:

a deposition source that discharges a deposition material;

a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and

a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction perpendicular to the first direction, wherein:

a deposition is performed while the substrate or the thin film deposition apparatus moves relative to the other in the first direction,

the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other, and

each of the patterning slits includes a plurality of sub-slits.

2. The thin film deposition apparatus of claim 1 , wherein a gap between neighboring patterning slits is greater than a gap between neighboring sub-slits included in one patterning slit.

3. The thin film deposition apparatus of claim 1 , wherein the sub-slits are arranged so that at least a part of a pattern that is formed of the deposition material discharged from one of the sub-slits included in one patterning slit towards the substrate and at least a part of a pattern that is formed of the deposition material discharged from the other of the sub-slits included in that patterning slit towards the substrate may overlap each other.

4. The thin film deposition apparatus of claim 1 , wherein the plurality of sub-slits are formed as rectangles arranged in parallel with each other.

5. The thin film deposition apparatus of claim 1 , wherein the plurality of sub-slits are holes arranged in a plurality of rows which are parallel with each other.

6. The thin film deposition apparatus of claim 1 , wherein the deposition source and the deposition source nozzle unit, and the patterning slit sheet are connected to the other by a connection member.

7. The thin film deposition apparatus of claim 6 , wherein the connection member guides movement of the discharged deposition material.

8. The thin film deposition apparatus of claim 6 , wherein the connection member seals a space between the deposition source and the deposition source nozzle unit, and the patterning slit sheet.

9. The thin film deposition apparatus of claim 1 , wherein the thin film deposition apparatus is separate from the substrate by a predetermined distance.

10. The thin film deposition apparatus of claim 1 , wherein the deposition material discharged from the thin film deposition apparatus is continuously deposited on the substrate while the substrate or the thin film deposition apparatus is moved relative to each other in the first direction.

11. The thin film deposition apparatus of claim 1 , wherein the patterning slit sheet of the thin film deposition apparatus is smaller than the substrate.

12. The thin film deposition apparatus of claim 1 , wherein the plurality of deposition source nozzles are tilted at a predetermined angle.

13. The thin film deposition apparatus of claim 12 , wherein the plurality of deposition source nozzles includes deposition source nozzles arranged in two rows formed in the first direction, and the deposition source nozzles in the two rows are tilted to face each other.

14. The thin film deposition apparatus of claim 12 , wherein the plurality of deposition source nozzles include deposition source nozzles arranged in two rows formed in the first direction, the deposition source nozzles arranged in the row located at a first side of the patterning slit sheet are arranged to face a second side of the patterning slit sheet, and the deposition source nozzles arranged in the other row located at the second side of the patterning slit sheet are arranged to face the first side of the patterning slit sheet.