MICROELECTRONIC PROCESSING COMPONENT HAVING A CORROSION-RESISTANT LAYER, MICROELECTRONIC WORKPIECE PROCESSING APPARATUS INCORPORATING SAME, AND METHOD OF FORMING AN ARTICLE HAVING THE CORROSION-RESISTANT LAYER
A microelectronic processing component can include a substrate and a corrosion-resistant layer. The substrate can include a metal-containing material, and the corrosion-resistant layer can be adjacent to the surface region. The corrosion-resistant layer can include a first portion and a second portion each including a rare earth compound, wherein the first portion is disposed between the substrate and the second portion, and the first portion has a first porosity, and the second portion has a second porosity that is greater than the first porosity. The component can be component within a processing apparatus used to process microelectronic workpieces. In a particular embodiment, the component can be exposed to the processing conditions as seen by the microelectronic workpiece when fabrication a microelectronic device from the microelectronic workpiece. Methods can be used to achieve the difference in porosity, and such methods can be for articles other than microelectronic processing components.
1 . A microelectronic processing component comprising:
a substrate including a metal-containing material; and
a corrosion-resistant layer adjacent to the metal-containing material, wherein:
the corrosion-resistant layer includes a first portion and a second portion each including a rare earth compound;
the first portion is disposed between the substrate and the second portion; and
the first portion has a first porosity, and the second portion has a second porosity that is greater than the first porosity.
2 . The component of claim 1 , wherein the component is part of a microelectronic processing apparatus.
3 - 4 . (canceled)
5 . The component of claim 1 , wherein the metal-containing material is an aluminum-containing material.
6 . The component of claim 1 , wherein the substrate has a surface region consisting essentially of alumina, stainless steel, silicon carbide, or aluminum nitride.
7 . The component of claim 1 , wherein the corrosion-resistant layer directly contacts the substrate.
8 . The component of claim 1 , further comprising an adhesion layer disposed between the substrate and the corrosion-resistant layer.
9 - 10 . (canceled)
11 . The component of claim 1 , wherein the rare earth compound comprises a rare earth oxide, a rare earth fluoride, or any combination thereof.
12 - 14 . (canceled)
15 . The component of claim 1 , wherein the first portion of the corrosion-resistant layer includes a discrete film having a porosity no greater than approximately 5%.
16 - 18 . (canceled)
19 . The component of claim 1 , wherein the second portion of the corrosion-resistant layer includes a discrete film having a porosity of at least approximately 5%.
20 . The component of claim 1 , wherein:
the corrosion-resistant layer has a porosity that changes as a continuous function of a distance from the substrate;
the second portion comprises a particular portion farthest from the substrate includes 10% of a total thickness of the corrosion-resistant layer; and
the second portion has an averaged porosity of at least approximately 5%.
21 . The component of claim 1 , wherein the second portion of the corrosion-resistant layer has a porosity no greater than approximately 25%.
22 - 24 . (canceled)
25 . The component of claim 1 , wherein:
the substrate includes a surface region consisting essentially of α-alumina or anodized aluminum;
the first portion comprises Y 2 O 3 and has a thickness in a range of approximately 15 microns to approximately 450 microns;
the first porosity is no greater than approximately 3.5%;
the second portion consists essentially of Y 2 O 3 and has a thickness in a range of approximately 25 microns to approximately 800 microns; and
the second porosity is in a range of approximately 5% to approximately 10%.
26 . A method of forming an article comprising:
providing a substrate including a metal-containing material;
thermally spraying a first portion of a corrosion-resistant layer on the substrate, wherein during a first time period, the thermal spraying is performed using a set of thermal spraying parameters;
changing a particular parameter within the set of thermal spraying parameters; and
after changing the particular parameter, thermally spraying a second portion of the corrosion-resistant layer, wherein the second portion is more porous than the first portion.
27 . The method of claim 26 , wherein the particular parameter includes a spray distance.
28 . The method of claim 26 , wherein the particular parameter includes an arc current.
29 - 30 . (canceled)
31 . The method of claim 26 , wherein the first portion and the second portion have substantially a same composition.
32 . (canceled)
33 . A microelectronic workpiece processing apparatus comprising:
a chamber at least partially defined by a chamber wall, the chamber wall having a surface region including a metal-containing material;
a corrosion-resistant layer lining the chamber wall and adjacent to the metal-containing material, wherein:
the corrosion-resistant layer includes a first portion and a second portion each including a rare earth compound;
the first portion is disposed between the substrate and the second portion; and
the first portion has a first porosity, and the second portion has a second porosity that is greater than the first porosity; and
a support for supporting a microelectronic workpiece in the chamber.
34 - 37 . (canceled)
38 . The apparatus of claim 33 , wherein the processing apparatus is an etching tool.
39 . The apparatus of claim 33 , wherein the metal-containing material comprises alumina, silica, silicon carbide, or aluminum nitride.
40 . (canceled)
41 . The apparatus of claim 33 , wherein the corrosion-resistant layer includes Y, Ce, La, or any combination thereof.
42 - 64 . (canceled)