Method for forming an electronic module having backside seal
View Patent ↗In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
1. A process for forming a first electronic module, the process comprising:
providing a meta-module including:
a substrate having a top surface and a bottom surface;
a first component area on the top surface of the substrate, and a second component area on the top surface of the substrate;
a first peripheral metallic structure located about a periphery of the first component area, and a second peripheral metallic structure located about a periphery of the second component area;
a body formed from a dielectric material, wherein the body covers: the first component area, the second component area, the first peripheral metallic structure, and the second peripheral metallic structure;
a perimeter seal structure located substantially on a perimeter of the bottom surface of the substrate, and not located on a portion of the bottom surface of the substrate which is internal to the perimeter of the bottom surface of the substrate;
placing the meta-module on a carrier medium, such that the perimeter seal structure seals against the carrier medium and blocks chemicals used during manufacture from penetrating the perimeter seal structure to reach the portion of the bottom surface of the substrate which is internal to the perimeter seal structure;
exposing at least a first portion of the first metallic structure and a second portion of the second metallic structure through the body; and
applying an electromagnetic shield material over the body, wherein the electromagnetic shield material contacts the exposed portions of the metallic structures, and shields the first component area and the second component area.
2. The process of claim 1 , wherein the perimeter seal structure comprises a metallic layer on the bottom surface of the substrate.
3. The process of claim 2 , wherein the perimeter seal structure further comprises a masking material placed on a surface of the metallic layer.
4. The process of claim 3 , wherein the masking material is a solder mask.
5. The process of claim 1 , wherein the perimeter seal structure is shaped like a ring.
6. The process of claim 1 , further comprising providing support structures on the bottom surface of the substrate, located internal to the peripheral seal structure, such that the support structures are configured to contact the carrier medium.
7. The process of claim 6 , wherein the support structures are configured to support the substrate at locations directly below the first and second peripheral metallic structures.
8. The process of claim 7 , wherein the support structures are constructed with the same materials as the perimeter seal structure.
9. The process of claim 1 , further comprising dividing, after applying the electromagnetic shield material, the meta-module to create a first electronic module including a shielded first component area and a separate second electronic module including a shielded second component area.