Integrated system on chip using multiple MEMS and CMOS devices
An integrated MEMS System. CMOS and MEMS devices can be provided in order to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured. The integrated MEMS devices can include, but not exclusively, an combination of the following types of sensors: magnetic, pressure, humidity, temperature, chemical, biological, or inertial. Furthermore, the overlying WLP layer can be configured to hermetically seal any number of these integrated devices. The present technique provides an easy to use process that relies upon conventional process technology without substantial modifications to conventional equipment and process and reduces off-chip connections, which make the mass production of smaller and thinner units possible.
1. A multiple MEMS and CMOS system comprising:
a semiconductor substrate having a surface region;
a CMOS IC layer overlying the surface region of the semiconductor substrate, the CMOS IC layer having at least one CMOS device being configured to provide a logic and a memory array, the CMOS IC layer having an interface region overlying the at least one CMOS device;
at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, herein the first MEMS is configured to sense first physical perturbations, wherein the first MEMS includes a MEMS transducer comprising:
a movable base having four intermediate cavities disposed in an intermediate portion of the movable base structure, the four intermediate cavities each having a cavity surface region;
four intermediate anchor structures spatially disposed within the four intermediate cavities, each of the intermediate anchor structures being coupled to at least one portion of the surface region;
four intermediate spring structure coupled to at least one portion of each of the cavity surface region, the intermediate spring structures being coupled to the intermediate anchor structures, the spring structures being spatially oriented to be substantially 45 degrees or substantially (pi/4) radians to the edges of a die; and
a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations.
2. The system of claim 1 wherein the first MEMS is selected from a group consisting of: an accelerometer, a gyroscope, magnetic sensor, a pressure sensor, a microphone, a humidity sensor, a temperature sensor, a chemical sensor, a biosensor, an inertial sensor.
3. The system of claim 1 wherein the second MEMS is selected from a group consisting of: an accelerometer, a gyroscope, magnetic sensor, a pressure sensor, a microphone, a humidity sensor, a temperature sensor, a chemical sensor, a biosensor, an inertial sensor.
4. The system of claim 1 wherein the first MEMS is fabricated from a deposited material that is used to fabricate the second MEMS.
5. The system of claim 1 wherein the first MEMS is fabricated using a mask layer that is used to fabricated the second MEMS.
6. The system of claim 1 wherein the first MEMS is fabricated using a semiconductor process that is used in fabricating the second MEMS.
7. The system of claim 1 wherein the one or more CMOS devices is further configured as one or more processing devices.
8. The system of claim 1 wherein the first portion of the interface region is spatially separated from the second portion of the interface region.
9. The system of claim 1 further comprising a third MEMS configured in one or more third regions and a fourth MEMS configured in one or more fourth regions;
whereupon the third MEMS is different from the fourth MEMS.
10. The system of claim 9 wherein the first MEMS comprises an accelerometer, the second MEMS comprises a gyroscope, the third MEMS comprises a magnetic sensor, and the fourth MEMS comprises a pressure sensor;
wherein the gyroscope comprises:
eight gyro anchor structures, the gyro anchor structures being coupled to at least one portion of the surface region;
two gyro frame structure, the gyro frame structure(s) spatially disposed overlying at least one portion of the surface region;
four gyro peripheral structures, the peripheral movable structures spatially disposed overlying at least one portion of the surface region;
two gyro central movable structures, the central movable structures spatially disposed overlying at least one portion of the surface region;
eight first gyro flexible members, the first gyro flexible members being coupled to at least one portion of the gyro anchor structures and the gyro frame structures; and
eight second gyro flexible members, the second gyro flexible members being coupled to at least one portion of the gyro frame structures and the gyro peripheral movable structure(s); and
eight gyro flexible structure members, the gyro flexible structure members being coupled to at least one portion of the gyro peripheral movable structures and the gyro central movable structures;
wherein the gyroscope is configured to have each central movable structures coupled to two of the peripheral movable structures by four gyro flexible structure members; wherein two peripheral movable structures are coupled to each gyro frame structure by four second gyro flexible members; and wherein four of the gyro anchor structures are coupled to each of the gyro frame structures by four first gyro flexible members.
11. The system of claim 1 wherein the first MEMS and the second MEMS comprises one or more deposited materials.
12. The system of claim 1 wherein the first MEMS and the second MEMS comprise one or more bonded materials.
13. The system of claim 1 wherein the interface region is integrated with the one or more CMOS devices.
14. The system of claim 1 wherein the first MEMS comprise an upper surface region that faces away from the one or more CMOS devices.
15. The system of claim 1 wherein the second MEMS comprises an upper surface region that faces away from the one or more CMOS devices.
16. The system of claim 1 wherein the MEMS transducer further comprises at least one capacitor element spatially configured within a vicinity of the cavity surface region(s) of the movable base structure, wherein the at least one capacitor element includes a fixed capacitor element and a movable capacitor element.
17. The system of claim 1 wherein the one or more CMOS devices are provided on a 0.18 micron design rule or less.
18. The system of claim 1 wherein the one or more CMOS devices comprise at least six metal layers.
19. The system of claim 1 further comprising an encapsulation structure overlying the first MEMS and the second MEMS.
20. The system of claim 1 further comprising a wafer level package structure enclosing the first MEMS and the second MEMS.
21. The system of claim 1 further comprising a wafer level package structure enclosing the first MEMS and the second MEMS and configured to hermetically seal the first and second MEMS.
22. The system of claim 1 further comprising a wafer level package structure enclosing the first MEMS and the second MEMS and configured to seal the first MEMS and the second MEMS.
23. The system of claim 1 wherein the first MEMS is at least a three axis accelerometer and the second MEMS is at least a six axis inertial sensing device.
24. The system of claim 23 wherein the six axis inertial sensing device is configured to detect an x-direction, a y-direction, a z-direction, linear motion, and angular motion.
25. The system of claim 1 wherein the first MEMS comprises a magnetic sensor, the magnetic sensor comprising a first electrode, a ferromagnetic material, and a second electrode.
26. The system of claim 1 wherein the one or more CMOS devices are configured from a foundry compatible process.
27. The system of claim 1
wherein the semiconductor substrate is encapsulated within a package, and
wherein the system further comprises:
a memory configured to store executable instructions;
a display configured to output data to a user; and
a processor electrically coupled to the memory and to the package, wherein the processor is configured to execute executable instructions from memory, wherein the processor is configured to receive signals from the first MEMS device in response to the first physical perturbations, wherein the processor is configured to perform one or more tasks in response to the signals from the first MEMS device, wherein the processor is configured to receive signals from the second MEMS device in response to the second physical perturbations, and wherein the processor is configured to perform one or more tasks in response to the signals from the second MEMS device.
28. A multiple MEMS and CMOS system comprising:
a semiconductor substrate having a surface region;
a CMOS IC layer overlying the surface region of the semiconductor substrate, the CMOS IC layer having at least one CMOS device being configured to provide a logic and a memory array, the CMOS IC layer having an interface region overlying the at least one CMOS device;
at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, herein the first MEMS is configured to sense first physical perturbations, wherein the first MEMS includes a MEMS differential gyroscope comprising:
wherein the gyroscope comprises:
eight gyro anchor structures, the gyro anchor structures being coupled to at least one portion of the surface region;
two gyro frame structure, the gyro frame structure(s) spatially disposed overlying at least one portion of the surface region;
four gyro peripheral structures, the peripheral movable structures spatially disposed overlying at least one portion of the surface region;
two gyro central movable structures, the central movable structures spatially disposed overlying at least one portion of the surface region;
eight first gyro flexible members, the first gyro flexible members being coupled to at least one portion of the gyro anchor structures and the gyro frame structures; and
eight second gyro flexible members, the second gyro flexible members being coupled to at least one portion of the gyro frame structures and the gyro peripheral movable structure(s); and
eight gyro flexible structure members, the gyro flexible structure members being coupled to at least one portion of the gyro peripheral movable structures and the gyro central movable structures;
wherein the gyroscope is configured to have each central movable structures coupled to two of the peripheral movable structures by four gyro flexible structure members; wherein two peripheral movable structures are coupled to each gyro frame structure by four second gyro flexible members; and wherein four of the gyro anchor structures are coupled to each of the gyro frame structures by four first gyro flexible members; and
a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations.