Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure
For forming a semiconductor device, a via structure is formed through at least one dielectric layer and at least a portion of a substrate. In addition, a protective buffer layer is formed onto the via structure. Furthermore, a conductive structure for an integrated circuit is formed over the substrate after forming the via structure and the protective buffer layer, with the conductive structure not being formed over the via structure. Thus, deterioration of the conductive and via structures is minimized.
1. A method for forming a semiconductor device, comprising:
forming a via structure through at least one dielectric layer and at least a portion of a substrate;
forming a protective buffer layer onto the via structure; and
forming a conductive structure for an integrated circuit over said substrate after forming the via structure and the buffer layer, with said conductive structure not being formed over the via structure,
wherein said conductive structure is formed through said at least one dielectric layer that has been formed before and under said protective buffer layer.
2. The method of claim 1 , further comprising:
heating said via structure to form an initial protrusion portion of the via structure; and
planarizing the via structure to remove said initial protrusion portion before forming said protective buffer layer onto the via structure.
3. The method of claim 1 , wherein the protective buffer layer remains on the via structure during said formation of said conductive structure for said integrated circuit.
4. The method of claim 1 , further comprising:
removing the protective buffer layer from the via structure; and
forming respective wiring onto each of said via structure and said conductive structure.
5. The method of claim 1 , further comprising:
forming a first insulation layer onto at least one wall of an opening having the via structure formed therein; and
forming a second insulation layer over the substrate with the via structure being planar with the second insulation layer, before the step of forming the protective buffer layer.
6. The method of claim 5 , wherein a ratio of a first thickness of the first insulation layer to a second thickness of the second insulation layer is in a range of from about 0.3:1 to about 0.9:1.
7. The method of claim 5 , wherein a thickness of the first insulation layer is less than ¼ of a diameter of said opening having the via structure formed therein.
8. The method of claim 5 , further comprising:
forming a barrier layer on the first insulation layer within the opening; and
forming a conductive fill within the opening after forming the barrier layer.
9. The method of claim 8 , wherein the conductive fill is comprised of copper.
10. The method of claim 8 , further comprising:
forming a center fill within the opening such that the conductive fill surrounds at least a portion of the center fill.
11. The method of claim 10 , wherein the center fill has a thermal expansion coefficient that is lower than that of the conductive fill.
12. The method of claim 11 , wherein the via structure is a TSV (through silicon via) formed within the opening through said at least one dielectric layer and the substrate.
13. The method of claim 12 , wherein the TSV is coupled to a contact structure of another semiconductor device for forming a stacked semiconductor device.
14. The method of claim 1 , wherein the via structure is a TSV (through silicon via) formed within an opening through said at least one dielectric layer and said substrate.
15. The method of claim 14 , wherein the TSV is coupled to a contact structure of another semiconductor device for forming a stacked semiconductor device.
16. The method of claim 15 , wherein the stacked semiconductor device is a memory device.
17. The method of claim 1 , further comprising:
forming a first insulation layer onto at least one wall of an opening having the via structure formed therein; and
forming a second insulation layer over the substrate with the via structure being planar with the second insulation layer,
wherein a ratio of a first thickness of the first insulation layer to a second thickness of the second insulation layer is in a range of from about 0.3:1 to about 0.9:1.
18. The method of claim 17 , further comprising:
forming a barrier layer on the first insulation layer within the opening; and
forming a conductive fill within the opening after forming the barrier layer.
19. The method of claim 18 , further comprising:
forming a center fill within the opening such that the conductive fill surrounds at least a portion of the center fill,
wherein the center fill has a thermal expansion coefficient that is lower than that of the conductive fill.