Planar wideband antenna

1. An apparatus, comprising:

an approximately planar wideband antenna including a first conductive portion coupled to a dielectric portion and mechanically supported by the dielectric portion, the first conductive portion including at least one edge corresponding to a planar conic section;

a matching circuit electrically coupled to the first conductive portion and configured to provide a specified input impedance corresponding to a specified range of frequencies;

a printed circuit board assembly including a return plane, wherein the return plane is located near a conductive housing and electrically coupled to the conductive housing;

wherein the specified range of frequencies includes a range of frequencies spanning at least an octave; and

wherein the planar conic section includes one or more of an elliptic, a parabolic, or a hyperbolic shape.

2. The apparatus of claim 1 , wherein the matching circuit is conductively coupled to the first conductive portion.

3. The apparatus of claim 1 , wherein the matching circuit is reactively coupled to the first conductive portion.

4. The apparatus of claim 1 , wherein the matching circuit comprises a distributed matching structure coupled to the first conductive portion of the planar wideband antenna and configured to provide, at least in part, the specified input impedance at least in part using a distributed inductance or capacitance of the distributed matching structure.

5. The apparatus of claim 2 , wherein the distributed matching structure includes a coplanar waveguide.

6. The apparatus of claim 4 , wherein the matching circuit comprises a discrete component; and

wherein the combination of the discrete component and the distributed matching structure are configured to provide the specified input impedance.

7. The apparatus of claim 1 , wherein the printed circuit board assembly includes a conductive layer comprising the first conductive portion and a dielectric layer comprising the dielectric portion.

8. The apparatus of claim 7 , wherein the dielectric portion includes a glass-epoxy laminate, and wherein the first conductive portion includes copper.

9. The apparatus of claim 1 , wherein the conductive housing at least partially contains a transmitter or a receiver circuit configured to use the planar wideband antenna to wirelessly transfer information electromagnetically using at least a portion of the specified range of frequencies.

10. The apparatus of claim 1 , comprising a second conductive portion including at least one edge corresponding to a planar conic section.

11. The apparatus of claim 10 , wherein one or more of the first conductive portion or the matching circuit is electrically coupled to the second conductive portion reactively.

12. The apparatus of claim 10 , wherein the first conductive portion is located on a first conductive layer of a printed circuit board assembly, and wherein the second conductive portion is located on a second conductive layer of the printed circuit board assembly.

13. The apparatus of claim 1 , wherein the specified range of frequencies includes a range from about 700 MHz. to about 2500 MHz.

14. A method, comprising:

forming an approximately planar wideband antenna including a first conductive portion coupled to a dielectric portion and mechanically supported by the dielectric portion, the first conductive portion including at least one edge corresponding to a planar conic section;

fabricating a printed circuit board assembly including a return plane, wherein the return plane is located near a conductive housing and electrically coupled to the conductive housing;

electrically coupling a matching circuit to the first conductive portion;

wherein the matching circuit provides a specified input impedance for the planar wideband antenna, the specified input impedance corresponding to a specified range of frequencies;

wherein the specified range of frequencies includes a range of frequencies spanning at least an octave; and

wherein the planar conic section includes one or more of an elliptic, a parabolic, or a hyperbolic shape.

15. The method of claim 14 , comprising providing a second conductive portion including at least one edge corresponding to a planar conic section.

16. The method of claim 15 , wherein the forming includes:

forming the first conductive portion on a first conductive layer;

forming the second conductive portion on a second conductive layer; and

separating the first and second conductive layers using the dielectric portion.

17. A method for forming an approximately planar wideband antenna, comprising:

patterning a first conductive portion onto a first conductive layer included as a portion of a printed circuit board assembly, the first conductive layer mechanically coupled to a dielectric portion of the printed circuit board assembly, and the first conductive portion including at least one edge corresponding to a planar conic section;

patterning at least a portion of a matching circuit onto the first conductive layer included as a portion of the printed circuit board assembly, the matching circuit electrically coupled to the first conductive portion and configured to provide a specified input impedance for the planar wideband antenna, the specified input impedance corresponding to a specified range of frequencies;

wherein the printed circuit board assembly includes a return plane that is located near a conductive housing and electrically coupled to the conductive housing;

wherein the specified range of frequencies includes a range of frequencies spanning at least an octave; and

wherein the planar conic section includes one or more of an elliptic, a parabolic, or a hyperbolic shape.

18. The method of claim 17 , wherein the forming a planar wideband antenna includes patterning a second conductive portion, the second conductive portion including at least one edge corresponding to a planar conic section.

19. The method of claim 18 , wherein patterning the second conductive portion includes patterning the second conductive portion onto a second conductive layer included as a portion of the printed circuit board assembly; and

wherein the first and second conductive layers are separated by the dielectric portion.