Organic light emitting diode display
View Patent ↗Disclosed is an organic light emitting diode (OLED) device, which includes: an organic light emitting diode including a first electrode, a second electrode, and an emission layer interposed between the first electrode and the second electrode; a base substrate supporting the organic light emitting diode; and a sealing member disposed on the base substrate while covering the organic light emitting diode. Herein, the sealing member includes a fluorinated epoxy sealing material including a fluorinated epoxy resin.
1. An organic light emitting diode (OLED) device, comprising:
an organic light emitting diode including a first electrode, a second electrode, and an emission layer interposed between the first electrode and the second electrode;
a base substrate supporting the organic light emitting diode; and
a sealing member disposed on the base substrate while covering the organic light emitting diode, wherein
the sealing member comprising a fluorinated epoxy sealing material comprising a fluorinated epoxy resin; and the fluorinated epoxy resin is selected from the group consisting of a fluorinated aromatic epoxy resin, a fluorinated alicyclic epoxy resin, and combinations thereof; and
the fluorinated epoxy sealing material further comprises a copolymer of the fluorinated epoxy resin and a resin selected from the group consisting of a (meth)acryl-based resin, polyisoprene, a vinyl-based resin, a urethane-based resin, a cellulose-based resin, a perylene-based resin, and combinations thereof.
2. The OLED device of claim 1 , wherein the sealing member further comprises a first primer layer interposed between the fluorinated epoxy sealing material and the base substrate.
3. The OLED device of claim 1 , wherein the sealing member is formed through a thin film-type encapsulation method where a front surface of the organic light emitting diode is coated with the fluorinated epoxy sealing material, and the sealing member further comprising an inorganic layer formed on the fluorinated epoxy sealing material.
4. The OLED device of claim 3 , wherein the inorganic layer comprises an inorganic material of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon oxynitride (SiON), and combinations thereof.