Multilayer printed circuit board
View Patent ↗A multilayer printed circuit board, including: a signal interconnection which transmits and receives an electrical signal between electronic components; a ground interconnection connected to a ground of a circuit; a power interconnection connected to a power layer to supply power to electronic components; at least one ground layer installed in an inner layer; at least one clearance which passes through the ground layer; and a ground via which connects the ground interconnection with the ground layer. The signal interconnection and the ground interconnection or the signal interconnection and the power interconnection are installed in a pair, and a pair of interconnection vias for interlayer connection are inserted through the clearance installed in the ground layer so that one of the pair of interconnection vias is connected to the ground layer by the ground interconnection.
1. A multilayer printed circuit board, comprising:
a signal interconnection which transmits and receives an electrical signal between electronic components;
a ground interconnection connected to a ground of a circuit;
a power interconnection connected to a power layer to supply power to the electronic components;
at least one ground layer installed in an inner layer;
at least one clearance which passes through the ground layer; and
a ground via which connects the ground interconnection with the ground layer,
wherein the signal interconnection and the ground interconnection or the signal interconnection and the power interconnection are installed in a pair, and
a pair of interconnection vias for interlayer connection are inserted through the clearance installed in the ground layer so that one of the pair of interconnection vias is connected to the ground layer by the ground interconnection.
2. The multilayer printed circuit board according to claim 1 , wherein the multilayer printed circuit board comprises at least two kinds of power sources separated in terms of direct current, and the power interconnection supplies at least part of power supplied to the electronic component to which the other interconnection paired with the power interconnection is connected.
3. The multilayer printed circuit board according to claim 1 , wherein, when at least two interconnection vias are disposed adjacent to each other and are inserted through the clearance installed in the ground layer, the pair of interconnection vias are disposed with the other interconnection vias being not disposed in a straight line connecting center points of the pair of interconnection vias, and the pair of interconnection vias have a gap smaller than that of the other interconnection vias.