Modular high-power drive stack cooled with vaporizable dielectric fluid

1. A high power drive stack system comprising:

a common support structure including:

a system power source,

a dielectric fluid cooling system, and

a plurality of receivers located in predetermined locations,

wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;

at least one module including:

a power component,

a dielectric fluid cooling circuit associated with the power component, and

at least two module connectors,

wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and

each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure;

wherein the dielectric fluid cooling system and the dielectric fluid cooling circuit utilize a vaporizable dielectric refrigerant; and

wherein the dielectric fluid cooling system comprises a plurality of fluid conduits, a pump, a condenser, and an evaporator, the evaporator positioned on the at least one module.

2. The system of claim 1 further including a plurality of modules.

3. The system of claim 2 , wherein the plurality of modules are stacked together and secured to the common support structure.

4. The system of claim 3 , wherein the common support structure is a rack or cabinet.

5. The system of claim 1 , wherein the electrical connection and the fluid connection formed by each module connector mating with a corresponding receiver connector is a dry-break connection.

6. The system of claim 5 , wherein the electrical connection and the fluid connection formed by each module connector mating with a corresponding receiver connector is a non-latching connection.

7. The system of claim 1 , wherein the module connectors and the receiver connectors form a plug and socket connection.

8. The system of claim 7 , wherein each plug and socket connection is formed at least in part as a hollow tube, at least a portion of the tube being conductive along its length and the tubes providing a fluid passageway when the plug is inserted into the tube.

9. A high power drive stack system comprising:

a common support structure including:

a system power source,

a dielectric fluid cooling system, and

a plurality of receivers located in predetermined locations,

wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;

at least one module including:

a power component,

a dielectric fluid cooling circuit associated with the power component, and

at least two module connectors,

wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and

each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure;

wherein the module further comprises a cold plate operating at the potential of a power component bonded directly to the cold plate.

10. The system of claim 1 , wherein at least portions of the module dielectric fluid cooling circuit associated with the power component are used as current carrying bus bars.

11. The system of claim 1 , wherein the power component of the at least one module is a silicon disk or die.

12. A high power drive stack system comprising:

a common support structure including:

a system power source,

a dielectric fluid cooling system, and

a plurality of receivers located in predetermined locations,

wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers,

at least one module including:

a power component,

a dielectric fluid cooling circuit associated with the power component, and

at least two module connectors,

wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and

each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure;

wherein the power component of the at least one module is a silicon disk or die;

wherein the at least one module further comprises a heat sink on both sides of the silicon disk or die, wherein the module dielectric fluid cooling circuit passes through both the heat sinks, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

13. A high power drive stack system comprising:

a common support structure including:

a system power source,

a dielectric fluid cooling system, and

a plurality of receivers located in predetermined locations,

wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;

at least one module including:

a power component

a dielectric fluid cooling circuit associated with the power component, and

at least two module connectors,

wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and

each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure;

wherein the power component of the at least one module is a silicon disk or die;

wherein a dielectric fluid of the module dielectric fluid cooling circuit is in direct contact with at least a portion of the silicon disk or die of the module, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.