Semiconductor photodetector that causes avalanche multiplication to occur only at photodetector portion located at central portion of mesa structure
View Patent ↗In order to improve reliability by preventing an edge breakdown in a semiconductor photodetector having a mesa structure such as a mesa APD, the semiconductor photodetector includes a mesa structure formed on a first semiconductor layer of the first conduction type formed on a semiconductor substrate, the mesa structure including a light absorbing layer for absorbing light, an electric field buffer layer for dropping an electric field intensity, an avalanche multiplication layer for causing avalanche multiplication to occur, and a second semiconductor layer of the second conduction type, wherein the thickness of the avalanche multiplication layer at the portion in the vicinity of the side face of the mesa structure is made thinner than the thickness at the central portion of the mesa structure.
1. A semiconductor photodetector comprising a mesa structure formed on a first semiconductor layer of the first conduction type formed on a semiconductor substrate, said mesa structure including:
a light absorbing layer for absorbing light;
an electric field buffer layer for dropping
an electric field intensity;
an avalanche multiplication layer for causing avalanche multiplication to occur; and
a second semiconductor layer of the second conduction type,
wherein said electric field buffer layer has a portion in the vicinity of the side face of said mesa structure, in which the carrier concentration is lower than that in other portions and has uniform thickness, and
wherein said electric field buffer layer is an n-type semiconductor layer and the portion in the vicinity of the side face of said mesa structure is doped with a p-type impurity.