Thin film transistor, display device including the same, and method of manufacturing the display device

1. A thin film transistor, comprising:

a substrate;

a gate electrode on the substrate;

a gate insulating layer on the gate electrode;

a semiconductor layer on the gate insulating layer; and

source/drain electrodes electrically connected with the semiconductor layer,

wherein:

the gate electrode has a thickness of about 500 Å to about 1500 Å and the gate insulating layer has a thickness of about 1600 Å to about 2500 Å,

the semiconductor layer has primary grain boundaries, and

a distance between the primary grain boundaries is about 2.75 μm to about 3 μm.

2. A display device, comprising:

a substrate having a first region and a second region;

a gate electrode on each of the first region and second region of the substrate, respectively;

a gate insulating layer on the gate electrode;

semiconductor layers on the gate insulating layer in the first region and second regions of the substrate, respectively; and

source/drain electrodes electrically connected with the semiconductor layers on the first region and the second region of the substrate, respectively,

wherein:

the gate electrode has a thickness of about 500 Å to about 1500 Å and the gate insulating layer has a thickness of about 1600 Å to about 2500 Å,

each of the semiconductor layers has a primary grain boundary, and

a distance between the primary grain boundaries of the respective semiconductor layers is about 2.75 μm to about 3 μm.

3. The display device as claimed in claim 2 , further comprising a gate line electrically connected with at least one gate electrode, the gate line being on one of the semiconductor layers corresponding to the at least one gate electrode.

4. The display device as claimed in claim 2 , further comprising:

a passivation layer on the substrate including the source/drain electrodes thereon; and

a gate line on the passivation layer, the gate line being electrically connected with the gate electrode of the first region through contact holes in the passivation layer and the gate insulating layer on the first region.

5. The display device as claimed in claim 2 , further comprising:

a passivation layer on the substrate including the source/drain electrodes; and

a connection member on the passivation layer, the connection member being electrically connected with the gate electrode on the second region through contact holes in the passivation layer and the gate insulating layer.

6. The display device as claimed in claim 5 , wherein the connection member is electrically connected with the drain electrode on the first region through a contact hole in the passivation layer.

7. The display device as claimed in claim 5 , further comprising a contact member on the passivation layer, the contact member being electrically connected with the drain electrode on the second region through contact holes in the passivation layer.

8. The display device as claimed in claim 7 , further comprising a pixel electrode on the passivation layer, the pixel electrode being electrically connected with the contact member.

9. A method of manufacturing a display device, the method comprising:

providing a substrate including a first region and a second region;

forming gate electrodes on the first region and second region of the substrate, respectively;

forming a gate insulating layer on the gate electrodes;

forming semiconductor layers on the gate insulating layer on the first region and second region of the substrate, respectively;

forming source/drain regions on certain regions of the semiconductor layers on the first region and second region of the substrate, respectively; and

forming source/drain electrodes in the first region and second region of the substrate, respectively, the source/drain electrodes being electrically connected with the semiconductor layers,

wherein:

the gate electrodes have a thickness of about 500 Å to about 1500 Å and the gate insulating layer has a thickness of about 1600 Å to about 2500 Å,

each of the semiconductor layers has a primary grain boundary, and

a distance between the primary grain boundaries of the respective semiconductor layers is about 2.75 μm to about 3 μm.

10. The method as claimed in claim 9 , wherein forming the semiconductor layer includes crystallization through sequential lateral solidification (SLS).

11. The method as claimed in claim 10 , wherein the SLS is performed using a mask having regions through which a laser beam penetrates.

12. The method as claimed in claim 11 , wherein:

the regions through which the laser beam penetrates have a length of about 4.5 μm to about 5.0 μm, and

a distance between the regions through which the laser beam penetrates is about 1.0 μm to about 1.5 μm.

13. The method as claimed in claim 9 , wherein forming the semiconductor layers includes:

forming an amorphous silicon (a-Si) layer on the gate insulating layer, and

performing an SLS process on the a-Si layer.