IP Library › Granted Patent US 8,436,690

Granted Patent B2

US 8,436,690 · App. 12/927,949 · Granted May 7, 2013

Hybrid system having a non-MEMS device and a MEMS device

View Patent ↗

Loading inventors, assignments & file history…

Monitor This Case

Get email alerts when status or documents change.

Order Certified Copies

Most orders are placed with the USPTO same day — all within 24 business hours.

Order via The Patent Place →

Pre-filled with this patent's details

Quick Facts

Patent No.: US 8,436,690
App. No.: 12/927,949
Granted: May 7, 2013
Kind: B2

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

A hybrid system having a non-MEMS device and a MEMS device is described. The apparatus includes a non-MEMS device and an integrated circuit including a MEMS device, the integrated circuit formed on a substrate. The integrated circuit includes a control circuit for the non-MEMS device and a MEMS control circuit for the MEMS device.

Claims (171)

1. An apparatus, comprising:

a non-MEMS device; and

an integrated circuit formed on a substrate, said integrated circuit comprising:

a control circuit for said non-MEMS device,

a MEMS device, and

a MEMS control circuit for said MEMS device,

said MEMS device being a MEMS inertial sensor that is selected from the group consisting of a MEMS accelerometer and a MEMS gyroscope; and

where the non-MEMS device is configured to produce an output that is at least one of an oscillation output, temperature sensing output, pressure sensing output, chemical sensing output, inertial sensing output, or a combination thereof.

2. The apparatus of claim 1 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

3. An apparatus, comprising:

a non-MEMS device; and

an integrated circuit formed on a substrate, said integrated circuit comprising:

a control circuit for said non-MEMS device,

a MEMS device, and

a MEMS control circuit for said MEMS device,

said MEMS control circuit comprising at least one of a MEMS oscillator circuit for generating an oscillation output, a MEMS temperature sensor circuit for generating a temperature output, a MEMS pressure sensor circuit for generating a pressure output, or a MEMS inertial sensor circuit for generating an inertial output; and

4. The apparatus of claim 3 , said MEMS control circuit comprising a MEMS temperature sensor circuit for generating a temperature output.

5. The apparatus of claim 3 , said MEMS control circuit comprising a MEMS pressure sensor circuit for generating a pressure output.

6. The apparatus of claim 3 , said MEMS control circuit comprising a MEMS inertial sensor circuit for generating an inertial output.

7. The apparatus of claim 3 , said MEMS control circuit comprising a MEMS oscillator circuit for generating an oscillation output.

8. The apparatus of claim 3 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

9. An apparatus, comprising:

a non-MEMS device; and

an integrated circuit formed on a substrate, said integrated circuit comprising:

a control circuit for said non-MEMS device,

a MEMS device, and

a MEMS control circuit for said MEMS device,

said MEMS control circuit comprising a MEMS temperature sensor circuit for generating a temperature output, and

said integrated circuit further comprising a MEMS oscillator circuit for generating an oscillation output;

10. The apparatus of claim 9 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

11. An apparatus, comprising:

a non-MEMS device; and

an integrated circuit formed on a substrate, said integrated circuit comprising:

a control circuit for said non-MEMS device,

a MEMS device, and

a MEMS control circuit for said MEMS device,

said MEMS control circuit being coupled to said control circuit for said non-MEMS device,

said non-MEMS device being a crystal,

said control circuit for said non-MEMS device being a crystal oscillator circuit, and

said MEMS control circuit comprising at least one of a MEMS oscillator circuit for outputting an oscillation output into said crystal oscillator circuit, a MEMS temperature sensor circuit for outputting a temperature output into said crystal oscillator circuit, a MEMS pressure sensor circuit for outputting a pressure output into said crystal oscillator circuit, or a MEMS inertial sensor circuit for outputting an inertial output into said crystal oscillator circuit.

12. The apparatus of claim 11 , said MEMS control circuit comprising a MEMS pressure sensor circuit for outputting a pressure output into said crystal oscillator circuit.

13. The apparatus of claim 11 , said MEMS control circuit comprising a MEMS inertial sensor circuit for outputting an inertial output into said crystal oscillator circuit.

14. The apparatus of claim 11 , said MEMS control circuit comprising a MEMS oscillator circuit for outputting an oscillation output into said crystal oscillator circuit.

15. The apparatus of claim 11 , said MEMS control circuit comprising a MEMS temperature sensor circuit for outputting a temperature output into said crystal oscillator circuit.

16. The apparatus of claim 15 , said integrated circuit further comprising a MEMS oscillator circuit for generating an oscillation output.

17. An apparatus, comprising:

a package;

a substrate housed in said package;

a non-MEMS device housed in said package; and

an integrated circuit comprising:

a plurality of devices formed in a semiconductor layer disposed above said substrate;

a MEMS device disposed above said substrate;

a MEMS control circuit, formed in a first portion of said plurality of semiconductor devices, for said MEMS device; and

a control circuit for said non-MEMS device, formed in a second portion of said plurality of semiconductor devices,

18. The apparatus of claim 17 , said MEMS control circuit comprising a MEMS pressure sensor circuit for generating a pressure output.

19. The apparatus of claim 17 , said MEMS control circuit comprising a MEMS inertial sensor circuit for generating an inertial output.

20. The apparatus of claim 17 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

21. The apparatus of claim 17 , wherein said non-MEMS device is a crystal and said control circuit for said non-MEMS device is a crystal control circuit, and wherein said MEMS control circuit provides an output that is coupled as an input to said crystal control circuit.

22. The apparatus of claim 17 , said MEMS control circuit comprising a MEMS oscillator circuit for generating an oscillation output.

23. The apparatus of claim 17 , said MEMS control circuit comprising a MEMS temperature sensor circuit for generating a temperature output.

24. The apparatus of claim 23 , said integrated circuit further comprising a MEMS oscillator circuit, formed in a third portion of said plurality of semiconductor devices, for generating an oscillation output.

25. An apparatus, comprising:

a package;

a substrate housed in said package;

a non-MEMS device housed in said package; and

an integrated circuit comprising:

a plurality of devices formed in a semiconductor layer disposed above said substrate,

a MEMS device disposed above said substrate,

a MEMS control circuit, formed in a first portion of said plurality of semiconductor devices, for said MEMS device, and

a control circuit for said non-MEMS device, formed in a second portion of said plurality of semiconductor devices,

said non-MEMS device being a crystal,

said control circuit for said non-MEMS device being a crystal control circuit,

said MEMS control circuit being coupled to said crystal control circuit, and

said MEMS control circuit comprising at least one of a MEMS oscillator circuit for outputting an oscillation output into said crystal control circuit, a MEMS temperature sensor circuit for outputting a temperature output into said crystal control circuit, a MEMS pressure sensor circuit for outputting a pressure output into said crystal control circuit, or a MEMS inertial sensor circuit for outputting an inertial output into said crystal control circuit.

26. The apparatus of claim 25 , said MEMS control circuit comprising a MEMS oscillator circuit for outputting an oscillation output into said crystal control circuit.

27. The apparatus of claim 25 , said MEMS control circuit comprising a MEMS temperature sensor circuit for outputting a temperature output into said crystal control circuit.

28. The apparatus of claim 27 , said integrated circuit further comprising a MEMS oscillator circuit, formed in a third portion of said plurality of semiconductor devices, for generating an oscillation output.

29. The apparatus of claim 25 , said MEMS control circuit comprising a MEMS pressure sensor circuit for outputting a pressure output into said crystal control circuit.

30. The apparatus of claim 25 , said MEMS control circuit comprising a MEMS inertial sensor circuit for outputting an inertial output into said crystal control circuit.

31. An apparatus, comprising:

a package;

a non-MEMS device housed in said package, said non-MEMS device being for producing a first output having a function;

a MEMS device housed in said package, said MEMS device being for producing an second output having said function;

a control circuit housed in said package, said control circuit being for said non-MEMS device; and

a MEMS control circuit housed in said package, said MEMS control circuit being for said MEMS device;

said control circuit for said non-MEMS device being coupled to said MEMS control circuit for said MEMS device; and

either said control circuit for said non-MEMS device being disposed on a first substrate with said MEMS control circuit for said MEMS device being disposed on a second substrate, or said control circuit for said non-MEMS device being disposed on a substrate with said MEMS control circuit for said MEMS device being also disposed on said substrate;

where said function comprises at least one of oscillation, temperature sensing, pressure sensing, chemical sensing, inertial sensing, or a combination thereof.

32. The apparatus of claim 31 , said control circuit for said non-MEMS device being disposed on a first substrate, and said MEMS control circuit for said MEMS device being disposed on a second substrate.

33. The apparatus of claim 31 , said control circuit for said non-MEMS device being disposed on a substrate, and said MEMS control circuit for said MEMS device being also disposed on said substrate.

34. The apparatus of claim 31 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

35. An apparatus, comprising:

a package;

a non-MEMS device housed in said package, wherein said non-MEMS device is for producing a first output having a function;

a MEMS device housed in said package, wherein said MEMS device is for producing an second output having said function;

a control circuit housed in said package, wherein said control circuit is for said non-MEMS device; and

a MEMS control circuit housed in said package, wherein said MEMS control circuit is for said MEMS device;

said control circuit for said non-MEMS device being coupled to said MEMS control circuit for said MEMS device; and

either said first output being for compensating said second output, or said second output being for compensating said first output.

36. The apparatus of claim 35 , said second output being for compensating said first output.

37. The apparatus of claim 35 , said first output being for compensating said second output.

38. The apparatus of claim 35 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

39. An apparatus, comprising:

a package;

a MEMS device disposed above a first substrate housed in said package;

a non-MEMS device housed in said package; and

a second substrate housed in said package, wherein said second substrate includes an integrated circuit disposed thereon, the integrated circuit comprising:

a MEMS control circuit for said MEMS device; and

a control circuit for said non-MEMS device.

40. The apparatus of claim 39 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

41. The apparatus of claim 39 , wherein said MEMS device is selected from the group consisting of a MEMS resonator, a MEMS temperature sensor, a MEMS inertial sensor, a MEMS pressure sensor, and a MEMS switch.

42. The apparatus of claim 39 , wherein said non-MEMS device is selected from the group consisting of a crystal, a thermistor, an accelerometer and a chemical sensor, and wherein said MEMS device is selected from the group consisting of a MEMS resonator, a MEMS temperature sensor, a MEMS inertial sensor, a MEMS pressure sensor, and a MEMS switch.

43. The apparatus of claim 39 , wherein said MEMS control circuit comprises a MEMS oscillator circuit for generating an oscillation output.

44. The apparatus of claim 39 , wherein said MEMS control circuit comprises a MEMS temperature sensor circuit for generating a temperature output.

45. The apparatus of claim 39 , wherein said MEMS control circuit comprises a MEMS pressure sensor circuit for generating a pressure output.

46. The apparatus of claim 39 , wherein said MEMS control circuit comprises a MEMS inertial sensor circuit for generating an inertial output.

47. The apparatus of claim 39 , wherein said MEMS control circuit comprises a MEMS temperature sensor circuit for generating a temperature output, said integrated circuit further comprising:

a MEMS oscillator circuit for generating an oscillation output.

48. The apparatus of claim 39 , wherein said MEMS device is for detecting an environmental change.

49. The apparatus of claim 39 , wherein said non-MEMS device is selected from the group consisting of a thermistor, an accelerometer and a chemical sensor, and wherein said non-MEMS device is disposed on a third substrate housed in said package.

50. The apparatus of claim 39 , wherein said non-MEMS device is a crystal, and wherein said control circuit for said non-MEMS device is a crystal control circuit.

51. The apparatus of claim 50 , wherein said MEMS control circuit provides an output that is coupled as an input to said crystal control circuit.

52. The apparatus of claim 39 , wherein said control circuit for said non-MEMS device is coupled to said MEMS control circuit for said MEMS device.

53. The apparatus of claim 52 , wherein said control circuit for said non-MEMS device is for outputting an oscillation output into said MEMS control circuit.

54. The apparatus of claim 52 , wherein said control circuit for said non-MEMS device is for outputting a temperature output into said MEMS control circuit.

55. The apparatus of claim 52 , wherein said control circuit for said non-MEMS device is for outputting a pressure output into said MEMS control circuit.

56. The apparatus of claim 52 , wherein said control circuit for said non-MEMS device is for outputting an inertial output into said MEMS control circuit.

57. The apparatus of claim 52 , wherein said MEMS control circuit comprises a MEMS inertial sensor circuit for outputting an inertial output into said control circuit for said non-MEMS device.

58. The apparatus of claim 52 , wherein said MEMS control circuit comprises a MEMS oscillator circuit for outputting an oscillation output into said control circuit for said non-MEMS device.

59. The apparatus of claim 52 , wherein said MEMS control circuit comprises a MEMS temperature sensor circuit for outputting a temperature output into said control circuit for said non-MEMS device.

60. The apparatus of claim 52 , wherein said MEMS control circuit comprises a MEMS pressure sensor circuit for outputting a pressure output into said control circuit for said non-MEMS device.

61. A method for crystal output compensation, comprising:

generating an output from a MEMS control circuit;

generating an output from a crystal control circuit, said crystal control circuit being coupled to said MEMS control circuit;

inputting said output from said MEMS control circuit to said crystal control circuit; and

modifying said output from said crystal control circuit based on said output from said MEMS control circuit;

said MEMS control circuit being at least one of a MEMS oscillator circuit, a MEMS temperature sensor circuit, a MEMS pressure sensor circuit, or a MEMS inertial sensor circuit; and

said output from said MEMS control circuit being at least one of an oscillation output, a temperature output, pressure output, or an inertial output.

62. The method of claim 61 , said MEMS control circuit being a MEMS oscillator circuit, and said output from said MEMS control circuit being an oscillation output.

63. The method of claim 61 , said MEMS control circuit being a MEMS temperature sensor circuit, and said output from said MEMS control circuit being a temperature output.

64. The method of claim 61 , said MEMS control circuit being a MEMS pressure sensor circuit, and said output from said MEMS control circuit being a pressure output.

65. The method of claim 61 , said MEMS control circuit being a MEMS inertial sensor circuit, and said output from said MEMS control circuit being an inertial output.

66. An apparatus, comprising:

a package;

a substrate housed in said package;

a non-MEMS device housed in said package; and

an integrated circuit comprising:

a plurality of devices formed in a semiconductor layer disposed above said substrate,

a MEMS device disposed above said substrate,

a MEMS control circuit, formed in a first portion of said plurality of semiconductor devices, for said MEMS device, and

a control circuit for said non-MEMS device, formed in a second portion of said plurality of semiconductor devices,

said integrated circuit further comprising a MEMS oscillator circuit, formed in a third portion of said plurality of semiconductor devices, for generating an oscillation output.

67. The apparatus of claim 66 , said MEMS control circuit comprising a MEMS temperature sensor circuit for generating a temperature output.

68. The apparatus of claim 66 , where the non-MEMS device comprises oscillator circuitry configured to produce an oscillation output.

69. The apparatus of claim 66 , where the non-MEMS device is configured to produce an output that is at least one of an oscillation output, temperature sensing output, pressure sensing output, chemical sensing output, inertial sensing output, or a combination thereof.

70. An apparatus, comprising:

a package;

a substrate housed in said package;

a non-MEMS device housed in said package; and

an integrated circuit comprising:

a plurality of devices formed in a semiconductor layer disposed above said substrate;

a MEMS device disposed above said substrate;

a MEMS control circuit, formed in a first portion of said plurality of semiconductor devices, for said MEMS device; and

a control circuit for said non-MEMS device, formed in a second portion of said plurality of semiconductor devices,

wherein said non-MEMS device is a crystal and said control circuit for said non-MEMS device is a crystal control circuit, and wherein said MEMS control circuit provides an output that is coupled as an input to said crystal control circuit.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2011

From: SILICON LABS SC, INC.

To: SILICON LABORATORIES INC.

Reel/Frame 025624/0190 →