IP Library Granted Patent US 8,282,385
Granted Patent B2
US 8,282,385 · App. 12/934,025 · Granted Oct 9, 2012

Die for molding ceramic honeycomb structure

Assignee: Hitachi Metals, Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,282,385
App. No.
12/934,025
Granted
Oct 9, 2012
Kind
B2
Abstract

A die comprising molding grooves arranged in a lattice pattern and moldable-material-supplying holes communicating with the molding grooves for molding a ceramic honeycomb structure, the molding grooves having width of 0.05-0.5 mm, the moldable-material-supplying holes being arranged in every intersecting portions of the molding grooves, or in every other intersecting portions of the molding grooves in a checkerboard pattern, and an average distance between the centers of the intersecting portions of the molding grooves, at which the moldable-material-supplying holes are arranged, and the center axes of the moldable-material-supplying holes being 10-100 μm.

Claims (4)

1. A die comprising molding grooves arranged in a lattice pattern and moldable-material-supplying holes communicating with said molding grooves for molding a ceramic honeycomb structure, said molding grooves having width of 0.05-0.5 mm, said moldable-material-supplying holes being arranged in every intersecting portions of said molding grooves, or in every other intersecting portions of said molding grooves in a checkerboard pattern, center axes of said moldable-material-supplying holes being dislocated from the centers of the intersecting portions of said molding grooves, and an average distance between the centers of the intersecting portions of said molding grooves, at which said moldable-material-supplying holes are arranged, and the center axes of said moldable-material-supplying holes being 10-100 μm.

2. The die for molding a ceramic honeycomb structure according to claim 1 , wherein the center axes of said moldable-material-supplying holes are arranged along each molding groove on both sides of its centerline.

3. The die for molding a ceramic honeycomb structure according to claim 1 , wherein the center axes of said moldable-material-supplying holes are arranged along each molding groove on the same side of its centerline.

4. The die for molding a ceramic honeycomb structure according to claim 1 , wherein the center axes of said moldable-material-supplying holes are arranged along each molding groove staggeringly along its centerline.

Assignments (4)
CHANGE OF ADDRESS Recorded Dec 9, 2025
From: HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 073917/0124 →
CHANGE OF NAME Recorded Dec 9, 2025
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 073917/0160 →
CHANGE OF ADDRESS Recorded Nov 20, 2025
From: HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 073636/0806 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2010
From: OGATA, TOMOHISA
To: HITACHI METALS, LTD.
Reel/Frame 025069/0382 →
Priority Claims (1)
JP 2008-087514 · Mar 28, 2008 · national
Continuity (1)
Related Publication 20110027406A1 · Feb 3, 2011