Heat equalizer and organic film forming apparatus
A heat equalizer includes a container structure having a heating block in which a working fluid is held for heating and vaporizing a material to be heated, a heater placed at the bottom of the container structure, and a material feed pipe allowing the outside and the inside of the container structure to communicate with each other. In the heating block, as a flow path in which the material to be heated flows, a main header pipe connected to the material feed pipe and extending in the horizontally, and a riser pipe branching from the main header pipe and extending vertically are formed. As a condensation path in which the working fluid is cooled and condensed, condensation holes formed respectively on the opposite sides of the riser pipe and extending horizontally, and a condensation pit formed under the riser pipe are formed. Between the condensation holes and the condensation pit, the main header pipe is placed.
1. A heat equalizer for vaporizing a material comprising:
a container structure having a closed space which is formed in the container structure and in which a working fluid is held;
heating means placed at a bottom of said container structure; and
a material feed pipe allowing an outside and an inside of said container structure to communicate with each other;
said container structure having a heating block for heating and vaporizing the material to be heated, and a housing surrounding said heating block, wherein
in said heating block, a flow path in which the material to be heated flows, and a condensation path in which the working fluid having been heated and evaporated by said heating means is cooled and condensed are formed,
said flow path includes a first flow path connected to said material feed pipe and extending in a horizontal direction, a second flow path branching from said first flow path and extending in a vertical direction, and an opening formed by an opening of said second flow path at an upper surface of said container structure,
said condensation path includes upper condensation holes formed respectively on opposite sides of said second flow path and extending in the horizontal direction, and a lower condensation pit formed under said first flow path, and
said first flow path is placed between said upper condensation holes and said lower condensation pit.
2. The heat equalizer according to claim 1 , wherein
said lower condensation pit is provided in a whole region of said first flow path.
3. The heat equalizer according to claim 2 , wherein
said upper condensation holes are extended along said second flow path.
4. The heat equalizer according to claim 2 , further comprising:
a pipe system coupled to said opening; and
heating equipment for heating said pipe system, wherein
a temperature of said pipe system and a temperature of said container structure are separately controlled.
5. The heat equalizer according to claim 2 , wherein
in at least one of a path in which said working fluid flows and a path in which said material to be heated flows, a passivation film containing a metal oxide is formed.
6. An organic film forming apparatus using the heat equalizer as recited in claim 2 .
7. The heat equalizer according to claim 1 , wherein
said upper condensation holes are extended along said second flow path.
8. The heat equalizer according to claim 1 , wherein
said upper condensation holes have a bottom surface inclined to allow said working fluid to return to a bottom portion of said container structure.
9. The heat equalizer according to claim 8 , wherein
said upper condensation holes have a horizontal ceiling surface.
10. The heat equalizer according to claim 9 , wherein
said upper condensation holes located respectively on two opposite sides of said second flow path and adjacent to each other have respective bottom surfaces inclined in different directions from each other.
11. The heat equalizer according to claim 8 , wherein
said upper condensation holes located respectively on two opposite sides of said second flow path and adjacent to each other have respective bottom surfaces inclined in different directions from each other.
12. The heat equalizer according to claim 1 , further comprising:
a pipe system coupled to said opening; and
heating equipment for heating said pipe system, wherein
a temperature of said pipe system and a temperature of said container structure are separately controlled.
13. The heat equalizer according to claim 1 , wherein
in at least one of a path in which said working fluid flows and a path in which said material to be heated flows, a passivation film containing a metal oxide is formed.
14. An organic film forming apparatus using the heat equalizer as recited in claim 1 .