IP Library Granted Patent US 8,724,973
Granted Patent B2
US 8,724,973 · App. 12/935,480 · Granted May 13, 2014

Heat equalizer

Inventors: Hisaaki Yamakage (Minato-ku, JP); Yoshihito Yamada (Minato-ku, JP)
Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
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Quick Facts
Patent No.
US 8,724,973
App. No.
12/935,480
Granted
May 13, 2014
Kind
B2
Abstract

A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.

Claims (26)

1. A heat equalizer comprising:

a container structure including an inner container and an outer container in which a working fluid is held, respective upper ends of said inner container and said outer container being joined to form a hollow portion between said inner container and said outer container;

a material feed pipe extending from an outside of said container structure to an inner surface of said inner container and configured to feed a material to be heated to within the inner container;

heating means placed at a bottom of said outer container; and

said inner container having a bottom surface including a plurality of protrusions protruding upwards toward an inside of said inner container away from a bottom surface of said outer container, and depressions formed by said bottom surface depressed inward of said protrusions and capable of receiving a vaporized working fluid from the outer container, the material to be heated being fed within the container and exposed to said protrusions for heat exchange from the vaporized working fluid to said material to be heated through said protrusions.

2. The heat equalizer according to claim 1 , wherein

said protrusions are each formed in a shape of a rectangular parallelepiped and are arranged in parallel with each other, and

said depressions are formed in a shape of a groove extending in a longitudinal direction of said rectangular parallelepiped of said protrusions.

3. The heat equalizer according to claim 1 , wherein

said depressions are formed in such a manner that a deepest portion of said depression is located at a higher level with respect to a position where said material feed pipe is connected to said inner container.

4. The heat equalizer according to claim 2 , wherein

said depressions are formed in such a manner that a deepest portion of said depression is located at a higher level with respect to a position where said material feed pipe is connected to said inner container.

5. The heat equalizer according to claim 1 , wherein

said heating means is in thermal contact with an outer surface of said outer container.

6. The heat equalizer according to claim 1 , wherein

a fin body is formed at an inner surface of the bottom of said outer container.

7. The heat equalizer according to claim 1 , wherein

a boiling promoter is placed at an inner surface of the bottom of said outer container.

8. The heat equalizer according to claim 1 , further comprising:

a heater housing tube having one end secured to said outer container and the other end immersed in the working fluid of liquid state; and

a heater housed in said heater housing tube and having a heat generating portion, wherein

said heat generating portion is placed away from said one end of said heater housing tube that is secured to said outer container.

9. The heat equalizer according to claim 8 , wherein

a fin body is formed at an outer surface of said heater housing tube.

10. The heat equalizer according to claim 8 , wherein

a boiling promoter is placed at an outer surface of said heater housing tube.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2010
From: YAMAKAGE, HISAAKI; YAMADA, YOSHIHITO
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 025135/0568 →
Continuity (1)
Related Publication 20110023862A1 · Feb 3, 2011