IP Library Granted Patent US 8,791,481
Granted Patent B2
US 8,791,481 · App. 12/936,071 · Granted Jul 29, 2014

Light emitting device and manufacturing method for same

Inventor: June O Song (Seoul, KR)
Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,791,481
App. No.
12/936,071
Granted
Jul 29, 2014
Kind
B2
Abstract

Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a support substrate, a reflective ohmic contact layer on the support substrate, a functional complex layer including a process assisting region and ohmic contact regions divided by the process assisting region on the reflective ohmic contact layer, and a light emitting semiconductor layer including a second conductive semiconductor layer, an active layer, and a first conductive semiconductor layer on each ohmic contact region.

Claims (15)

1. A light emitting device comprising:

a support substrate;

a reflective layer on the support substrate;

a complex layer including a current blocking region and ohmic contact regions on the reflective layer;

a light emitting semiconductor layer disposed on the complex layer and including a second conductive semiconductor layer, an active layer on the second conductive semiconductor layer, and a first conductive semiconductor layer on the active layer;

a passivation layer disposed on the complex layer, the light emitting semiconductor layer divided into a plurality of regions by a portion of the passivation layer; and

a first electrode disposed on the light emitting semiconductor layer and the portion of the passivation layer.

2. The light emitting device of claim 1 , further comprising a diffusion barrier layer between the reflective layer and the support substrate.

3. The light emitting device of claim 2 , further comprising a wafer bonding layer between the diffusion barrier layer and the support substrate.

4. The light emitting device of claim 1 , wherein the passivation layer is at both of a lateral surface and a portion of a top surface of the light emitting semiconductor layer.

5. The light emitting device of claim 1 , wherein the current blocking region includes one of an electric insulating material, an empty space filled with air, or a material forming a schottky contact interface with respect to the second conductive semiconductor layer.

6. The light emitting device of claim 1 , further comprising a light extracting structure on the light emitting structure.

7. The light emitting device of claim 6 , wherein the light extracting structure contacts the light emitting structure.

8. The light emitting device of claim 6 , wherein a top surface of the first electrode is higher than a top surface of the light extracting structure.

9. The light emitting device of claim 1 , wherein a lowermost surface of the first electrode is lower than a top surface of the active layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2011
From: SONG, JUNE O
To: LG INNOTEK CO., LTD.
Reel/Frame 025851/0783 →
Priority Claims (1)
KR 10-2008-0030106 · Apr 1, 2008 · national
Continuity (1)
Related Publication 20110168971A1 · Jul 14, 2011