Method to provide microstructure for encapsulated high-brightness LED chips
View Patent ↗Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.
1. A method of manufacturing an encapsulated LED comprising:
providing an LED chip;
providing a mold tool defining a cavity that defines a lens shape;
providing a patterned release film defining the inverse of a microstructure in a surface thereof;
conforming the patterned release film to the cavity of the mold tool;
spacing the LED chip from the patterned release film in the cavity;
introducing resin into the space between the LED chip and the patterned release film in the cavity;
curing the resin in the space between the LED chip and the patterned release film in the cavity while maintaining contact between the patterned release film and the resin;
freeing the encapsulated LED from the mold tool and the patterned release film.
2. The method of claim 1 where the patterned release film forms a diffuser.
3. The method of claim 1 , wherein:
the LED chip is either an RGB diode package or a phosphor coated blue LED package;
the mold tool defines a cavity that is generally hemispherical;
the patterned release film is a fluoropolymer film having the microstructure integrally formed in the film; and
the resin is an optical quality silicone resin.
4. The method of claim 2 where the patterned release film forms a light shaping diffuser.
5. The method of claim 3 , where the pattern embodied in the release film comprises microstructures, the microstructures having a feature size of up to about 100 micrometers.
6. The method of claim 5 , where the pattern embodies in the release film is the inverse of the microstructure of the embossing tool (such as nickel shim).
7. The method of claim 6 , where the light shaping diffuser microstructure is random, disordered, and non-planar speckles that are non-discontinuous and have smoothly varying changes so as to provide scatter with non-discontinuous transmission of light through the microstructure.
8. The method of claim 7 , where the light shaping diffuser structure has the structure of recorded laser speckle.
9. The method of claim 8 , where the light shaping diffuser structure is of the type shown in FIG. 3 .