Poly lactic acid resin, resin composition, and resin molding

1. A resin composition comprising a poly lactic acid resin comprising

an L-lactic acid block and a D-lactic acid block, which blocks are bonded by carbonate bonding; and

a compound having flame retardancy kneaded with the L-lactic acid block and the D-lactic acid block, which blocks are bonded by carbonate bonding, wherein

the compound having flame retardancy is a compound that exhibits no flame retardancy by itself, but exhibits flame a retardancy of HB or higher as defined by UL-94 when the compound is added to a resin composition that has a flame retardancy of lower than HB as defined by UL-94.

2. The resin composition according to claim 1 , wherein an average composition ratio by weight of the L-lactic acid block to the D-lactic acid block is from about 15:85 to about 85:15.

3. The resin composition according to claim 1 , wherein the resin composition further contains at least one resin selected from the group consisting of a poly lactic acid resin, a polycarbonate resin, a polypropylene resin, a polyester resin, and a polyamide resin.

4. The resin composition according to claim 1 , wherein a crystallization rate of the resin composition is from about 15 sec to about 60 sec.

5. A resin molding comprising

a poly lactic acid resin comprising an L-lactic acid block and a D-lactic acid block, which blocks are bonded by carbonate bonding; and

a compound having flame retardancy kneaded with the L-lactic acid block and the D-lactic acid block, which blocks are bonded by carbonate bonding, wherein

the compound having flame retardancy is a compound that exhibits no flame retardancy by itself, but exhibits flame a retardancy of HB or higher as defined by UL-94 when the compound is added to a resin composition that has a flame retardancy of lower than HB as defined by UL-94.

6. The resin molding according to claim 5 , wherein an average composition ratio by weight of the L-lactic acid block to the D-lactic acid block is from about 15:85 to about 85:15.

7. The resin molding according to claim 5 , wherein the resin molding further contains at least one resin selected from the group consisting of a poly lactic acid resin, a polycarbonate resin, a polypropylene resin, a polyester resin, and a polyamide resin.

8. The resin molding according to claim 5 , wherein a crystallization rate of the resin molding is from about 15 sec to about 60 sec.

9. The resin molding according to claim 5 , wherein a component of an electronic or electric instrument comprises the resin molding.

10. The resin composition according to claim 1 , wherein the compound having flame retardancy is a member selected from the group consisting of a phosphorus-based flame retardant, a silicone-based flame retardant, a nitrogen-containing flame retardant, a sulfuric acid-based flame retardant, and an inorganic hydroxide-based flame retardant.

11. The resin composition according to claim 1 , wherein the compound having flame retardancy is a member selected from the group consisting of melamine phosphate, ammonium phosphate, aluminum phosphate, dimethyl siloxane, nano silica, silicone-modified polycarbonate, a melamine compound, a triazine compound, melamine sulfate, guanidine sulfate, magnesium hydroxide, and aluminum hydroxide.

12. The resin molding according to claim 5 , wherein the compound having flame retardancy is a member selected from the group consisting of a phosphorus-based flame retardant, a silicone-based flame retardant, a nitrogen-containing flame retardant, a sulfuric acid-based flame retardant, and an inorganic hydroxide-based flame retardant.

13. The resin molding according to claim 5 , wherein the compound having flame retardancy is a member selected from the group consisting of melamine phosphate, ammonium phosphate, aluminum phosphate, dimethyl siloxane, nano silica, silicone-modified polycarbonate, a melamine compound, a triazine compound, melamine sulfate, guanidine sulfate, magnesium hydroxide, and aluminum hydroxide.