IP Library Granted Patent US 8,325,775
Granted Patent B2
US 8,325,775 · App. 12/941,940 · Granted Dec 4, 2012

Efficient carrier injection in a semiconductor device

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Quick Facts
Patent No.
US 8,325,775
App. No.
12/941,940
Granted
Dec 4, 2012
Kind
B2
Abstract

Semiconductor devices such as VCSELs, SELs, LEDs, and HBTs are manufactured to have a wide bandgap material near a narrow bandgap material. Electron injection is improved by an intermediate structure positioned between the wide bandgap material and the narrow bandgap material. The intermediate structure is an inflection, such as a plateau, in the ramping of the composition between the wide bandgap material and the narrow bandgap material. The intermediate structure is highly doped and has a composition with a desired low electron affinity. The injection structure can be used on the p-side of a device with a p-doped intermediate structure at high hole affinity.

Claims (31)

1. A light emitting semiconductor device with efficient electron injection from a wide bandgap semiconductor material into a narrower bandgap semiconductor material, comprising:

an active region comprising one or more quantum wells and one or more quantum well barriers and having a quantum well barrier bounding each side of the active region;

an injection structure adjacent to one of the bounding quantum well barriers of the active region, the injection structure being formed from a semiconductor material comprising AlGaAs, the injection structure comprising:

an n-doped confining region having the formula Al x Ga 1-x As where x is in a range from about 0.7 to about 1.0; and

an n-doped intermediate structure positioned between the confining region and the active region, the intermediate structure comprises an inflection in a ramping of the aluminum content from the active region to the confining region, the intermediate structure having the formula Al x Ga 1-x As where x is in a range from about 0.35 to about 0.7.

2. A semiconductor device as in claim 1 , wherein the doping in the intermediate structure is greater than 5×10 17 /cm 3 .

3. A semiconductor device as in claim 1 , further comprising a substantially undoped portion position between the intermediate structure and the active region.

4. A semiconductor device as in claim 1 , wherein the thickness of the confining region is in a range from about 5 nm to about 100 nm.

5. A semiconductor device as in claim 1 , wherein the dopant level in the confining region is in a range of about 5×10 17 /cm 3 to about 1×10 19 /cm 3 .

6. A semiconductor device as in claim 1 , further comprising a spacer layer adjacent the confining region, the spacer layer having the formula Al x Ga 1-x As where x is in a range from about 0.4 to about 0.6.

7. A light emitting semiconductor device with efficient electron injection from a wide bandgap semiconductor material into a narrower bandgap semiconductor material, comprising:

an active region comprising one or more quantum wells and one or more quantum well barriers;

an injection structure adjacent the active region, the injection structure being formed from a semiconductor material comprising AlInGaP, the injection structure comprising:

an n-doped confining region having the formula (Al x Ga 1-x )InP where x is in a range from about 0.8 to about 1.0; and

an n-doped intermediate structure positioned between the confining region and the active region, the intermediate structure having the formula (Al x Ga 1-x )InP, where x is in a range from about 0.4 to about 0.8.

8. A semiconductor device as in claim 7 , wherein the intermediate structure comprises an inflection in a ramping of the aluminum content from the active region to the confining region.

9. A semiconductor device as in claim 7 , wherein the doping in the intermediate structure is greater than 5×10 17 /cm 3 .

10. A semiconductor device as in claim 7 , further comprising a substantially undoped portion positioned between the intermediate structure and the active region.

11. A semiconductor device as in claim 7 , wherein the (Al x Ga 1-x )InP is substantially lattice matched to GaAs.

12. A semiconductor device as in claim 7 , wherein the thickness of the confining region is in a range from about 5 nm to about 100 nm.

13. A semiconductor device as in claim 7 , wherein the dopant level in the confining region is in a range of about 5×10 17 /cm 3 to about 1×10 19 /cm 3 .

14. A semiconductor device as in claim 7 , further comprising a spacer layer adjacent the confining region, the spacer layer having an aluminum content that is less than the confining region.

15. A light emitting semiconductor device with efficient electron injection from a wide bandgap semiconductor material into a narrower bandgap semiconductor material, comprising:

an active region comprising one or more quantum wells and one or more quantum well barriers;

an injection structure adjacent to the active region, the injection structure being formed from a semiconductor material comprising AlGaAs, the injection structure comprising:

an n-doped confining region having the formula Al x Ga 1-x As where x is in a range from about 0.7 to about 1.0; and

an n-doped intermediate structure positioned between the confining region and the active region, the intermediate structure having the formula Al x Ga 1-x As where x is in a range from about 0.35 to about 0.7, wherein the intermediate structure comprises an inflection in a ramping of the aluminum content from the active region to the confining region.

16. A semiconductor device as in claim 15 , wherein the doping in the intermediate structure is greater than 5×10 17 /cm 3 .

17. A semiconductor device as in claim 15 , further comprising a substantially undoped portion position between the intermediate structure and the active region.

18. A semiconductor device as in claim 15 , wherein the thickness of the confining region is in a range from about 5 nm to about 100 nm.

19. A semiconductor device as in claim 15 , further comprising a spacer layer adjacent the confining region, the spacer layer having the formula Al x Ga 1-x As where x is in a range from about 0.4 to about 0.6.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2019
From: JOHNSON, RALPH H.
To: FINISAR CORPORATION
Reel/Frame 049259/0229 →