IP Library Granted Patent US 8,653,547
Granted Patent B2
US 8,653,547 · App. 12/943,628 · Granted Feb 18, 2014

Light emitting device and light emitting device package

Inventors: Hwan Hee Jeong (Seoul, KR); Sang Youl Lee (Seoul, KR); June O Song (Seoul, KR); Kwang Ki Choi (Seoul, KR)
Assignee: LG Innotek Co., Ltd
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Quick Facts
Patent No.
US 8,653,547
App. No.
12/943,628
Granted
Feb 18, 2014
Kind
B2
Abstract

Provided are a light emitting device and a light emitting device package. The light emitting device includes a first electrode, a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode, a second electrode on the light emitting structure, and a reflective member on at least lateral surface of the second electrode.

Claims (47)

1. A light emitting device comprising:

a first electrode;

a light emitting structure comprising a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode;

a second electrode on the light emitting structure;

a reflective member disposed on a lateral surface of the second electrode;

a channel layer on a circumference region between the first electrode and the light emitting structure; and

at least one reflective layer, an ohmic contact layer, and a current blocking layer between the first electrode and the light emitting structure.

2. The light emitting device of claim 1 , wherein the second electrode comprises:

an electrode pad region for wire-bonding; and

a plurality of current spreading patterns branched into one or more sides from the electrode pad region.

3. The light emitting device of claim 2 , wherein the reflective member is disposed on a lateral surface of the electrode pad region.

4. The light emitting device of claim 3 , wherein the reflective member contacts the second semiconductor layer and extends into a circumference region of a top surface of the electrode pad region via the lateral surface of the electrode pad region.

5. The light emitting device of claim 4 , further comprising an adhesive layer between the second electrode and the reflective member.

6. The light emitting device of claim 2 , wherein the reflective member contacts the second semiconductor layer and is disposed on a top surface of each of the current spread patterns of the plurality of current spread patterns and a lateral surface of each of the current spreading patterns, respectively.

7. The light emitting device of claim 2 , wherein the electrode pad region and the plurality of current spread patterns comprise a plurality of layers, respectively.

8. The light emitting device of claim 7 , wherein the electrode pad region and the plurality of current spread patterns comprise layers different from each other, respectively.

9. The light emitting device of claim 7 , wherein the electrode pad region has a thickness greater than that of each of the plurality of current spreading patterns.

10. The light emitting device of claim 1 , wherein a lateral surface of the second electrode has a vertical surface, and a lateral surface of the reflective member has a vertical surface corresponding to that of the second electrode.

11. The light emitting device of claim 10 , wherein the lateral surface of the second electrode has an uneven pattern structure, and the lateral surface of the reflective member has an uneven pattern structure corresponding to that of the second electrode.

12. The light emitting device of claim 1 , wherein the lateral surface of the second electrode has an inclined surface, and a lateral surface of the reflective member has an inclined surface corresponding to that of the second electrode.

13. The light emitting device of claim 12 , wherein the lateral surface of the second electrode has an uneven pattern structure, and the lateral surface of the reflective member has an uneven pattern structure corresponding to that of the second electrode.

14. The light emitting device of claim 1 , wherein the reflective member has a thickness of about 1 μm to about 10 μm.

15. The light emitting device of claim 1 , wherein the reflective layer is disposed on the first electrode, and the ohmic contact layer is disposed between the reflective layer and the light emitting structure.

16. The light emitting device of claim 1 , wherein the current blocking layer vertically overlaps a portion of the second electrode.

17. The light emitting device of claim 1 , further comprising:

a passivation layer contacting the channel layer, the passivation layer extending toward a lateral surface of the light emitting structure.

18. A light emitting device comprising:

a first electrode;

an adhesive layer on the first electrode;

a reflective layer on the adhesive layer;

an ohmic contact layer on the reflective layer;

a channel layer on the adhesive layer disposed on a lateral surface of the ohmic contact layer;

a light emitting structure comprising a first semiconductor layer on the channel layer and the ohmic contact layer, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer;

a second electrode on the light emitting structure, the second electrode having an inclined and uneven surface;

a reflective member on a lateral surface of the second electrode, the reflective member having a shape corresponding to that of the lateral surface of the second electrode; and

a passivation layer extending from a top surface of the channel layer to a lateral surface of the light emitting structure.

19. A light emitting device package comprising:

a body;

a lead electrode on the body; and

a light emitting device electrically connected to the lead electrode,

wherein the light emitting device comprises:

a first electrode;

a light emitting structure comprising a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode;

a second electrode on the light emitting structure;

a reflective member disposed on a lateral surface of the second electrode;

a channel layer on a circumference region between the first electrode and the light emitting structure; and

at least one of a reflective layer, an ohmic contact layer, and a currently blocking layer between the first electrode and the light emitting structure.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2025
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: BOE HC SEMITEK LIMITED(HENGQIN)
Reel/Frame 070521/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2010
From: JEONG, HWAN HEE; LEE, SANG YOUL; SONG, JUNE O; CHOI, KWANG KI
To: LG INNOTEK CO., LTD.
Reel/Frame 025359/0794 →
Priority Claims (1)
KR 10-2010-0021289 · Mar 10, 2010 · national
Continuity (1)
Related Publication 20110220937A1 · Sep 15, 2011