RFID devices and methods for manufacturing
View Patent ↗A RFID device includes a substrate, a conductive element, and a RFID chip. The conductive element is coupled to the substrate and defines at least one pathway. The RFID chip includes an integrated circuit, a terminal, and an electrical lead connecting the integrated circuit and the terminal. The terminal is in electrical communication with the conductive element. The RFID chip is positioned so that a first portion of the RFID chip is positioned above the conductive element and a second portion of the RFID chip is positioned above the at least one pathway. Methods are also provided.
1. A RFID (Radio Frequency Identification) device mounted proximate to a metal object, comprising:
a RFID inlay, the inlay having a substrate, a conductive element, and a RFID chip;
the conductive element having a plurality of legs and is provided on the substrate and defines at least one pathway;
the RFID chip includes an integrated circuit, a terminal and an electrical lead connecting the integrated circuit and the terminal;
the terminal is in electrical communication with the conductive element;
the RFID device is positioned so that a first portion of the RFID device is positioned about the conductive element and a second portion of the RFID device is positioned above the at least one pathway; and
wherein size, shape, and arrangement of both the conductive element and the at least one pathway acts to balance a decrease in inductance and an increase in capacitance of the RFID device when positioned in close proximity to the metal object.
2. A RFID device according to claim 1 , wherein the chip is provided on a strap.
3. A RFID device according to claim 1 , wherein the substrate includes one of the group consisting of polyethylene terephthalate, polyvinyl chloride, polystyrene, polyethylene, or nylons.
4. A RFID device according to claim 1 , wherein the conductive element is fabricated from copper or aluminum.
5. A RFID device of claim 1 , wherein the RFID chip is positioned over the at least one pathway.
6. A RFID device of claim 1 , wherein the RFID devices holds recycling information.
7. A RFID device as recited in claim 1 , wherein the inlay includes a strap that has a portion provided over the at least one pathway and another portion provided over the substrate.
8. A RFID device as recited in claim 7 , wherein the strap is provided in one of a planar or a non-planar arrangement with a lid of the container.
9. The RFID device of claim 1 , wherein the RFID device is substantially insensitive to a spacing between the RFID device and a metallic surface of the metal object.