System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
A sensor processor system is provided on a platform including a semiconductor substrate. The system has multiple integrated subsystems including a micro controller unit provided on one or more first regions of the semiconductor substrate. The subsystems also include an array of programmable memory provided on one or more second regions of the semiconductor substrate, among other elements. The subsystems also include one or more MEMS devices operably coupled to the micro controller unit. In one or more embodiments, an application processor is coupled to the semiconductor substrate and, optionally, a baseband processor is coupled to the semiconductor substrate.
1. A computing system for sensing physical status data using MEMS (Micro Electro-Mechanical System) devices, the system comprising:
an executable memory configured to store a plurality of executable code;
one or more application processors coupled to the memory, wherein the one or more application processors are configured to execute the plurality of executable code;
one or more baseband processors coupled to the one or more application processors, wherein the one or more baseband processors are configured for at least a wireless communication protocol; and
a MEMS system coupled to the application processor, wherein the MEMS system comprises:
the MEMS devices configured to sense physical perturbations, wherein the MEMS devices includes at least a MEMS transducer apparatus comprising:
a substrate member having a surface region,
a movable base having at least one intermediate cavity disposed in an intermediate portion of the movable base structure, the at least one intermediate cavity having a cavity surface region;
at least one intermediate anchor structure spatially disposed within the at least one intermediate cavity, the intermediate anchor structure(s) being coupled to at least one portion of the surface region;
at least one intermediate spring structure coupled to at least one portion of the cavity surface region, the intermediate spring structure(s) being coupled to the intermediate anchor structure(s), the spring structure(s) being spatially oriented to be substantially 45 degrees or substantially (pi/4) radians to edges of a die; and
at least one capacitor element, the capacitor element(s) being spatially disposed within a vicinity of the intermediate cavity; and
one or more sensor processors coupled to the MEMS devices, wherein the one or more sensor processors are configured to provide physical status data to the one or more application processors in response to the physical perturbations sensed by the MEMS devices;
wherein the one or more application processors are also configured to execute the plurality of executable code in response to the physical status data.
2. The system of claim 1 wherein the one or more baseband processors is configured for a GPS (Global Positioning System), a FM (Frequency Modulation), a Bluetooth, or a Zigbee/Zwave communication interface.
3. The system of claim 1 wherein the one or more sensor processors is coupled to the one or more baseband processors using at least an interface selected from a group consisting of: a serial peripheral interface bus, a CS (Chip Select) interface.
4. The system of claim 1 wherein the one or more application processors are coupled to the MEMS system using at least an interface selected from a group consisting of: application programming interface bus, a serial peripheral interface bus.
5. The system of claim 1 wherein the MEMS devices are selected from a group consisting of: an accelerometer, a gyroscope, magnetic sensor, a pressure sensor, a microphone, a humidity sensor, a temperature sensor, a chemical sensor, a biosensor, an inertial sensor.
6. The system of claim 1 wherein the one or more sensor processors are configured to output one of a plurality of logic modes.
7. The system of claim 1 wherein the one or more sensor processors are configured to output one of a plurality of logic modes, wherein the plurality of logic modes are respectively associated with a plurality of extrinsic properties, each of the extrinsic properties defining a movement state of at least one of the MEMS devices.
8. The system of claim 1 wherein the one or more sensor processors comprises an array of programmable memories.
9. The system of claim 1 wherein the one or more sensor processors is provided on a general purpose sensor platform.
10. The system of claim 1 further comprising one or more analog front end modules provided between the two or more MEMS devices and the one or more sensor processors.
11. The system of claim 1 wherein at least one of the MEMS devices is coupled to an analog front end, the analog front end is coupled to an analog to digital converter device, and wherein the analog to digital converter device is coupled to the one or more sensor processors.
12. The system of claim 1 wherein the one or more application processors is integrally coupled to the one or more sensor processors; and the one or more baseband processors is integrally coupled to the one or more sensor processors.