Granted Patent B2

US 8,562,740 · App. 12/947,936 · Granted Oct 22, 2013

Abstract

Claims (33)

1. An apparatus for directional solidification of silicon, comprising:

a directional solidification mold including at least one refractory material;

an outer jacket; and an insulating layer disposed at least partially between the directional solidification mold and the outer jacket, wherein the insulating layer is in contact with at least a portion of the directional solidification mold, a portion of an inner side surface of the outer jacket, and at least a portion of an inner bottom surface of the outer jacket, and wherein the insulating layer is not disposed between the bottom of the directional solidification mold and the inner bottom surface of the outer jacket, and the directional solidification mold is in contact with at least a portion of the inner bottom surface of the outer jacket.

2. The apparatus of claim 1 , wherein the directional solidification mold, the outer jacket and the insulating layer are configured to be used more than twice for the directional solidification of silicon.

3. The apparatus of claim 1 , wherein one or more side walls of the directional solidification mold include a different thickness, material composition or amount of material relative to a bottom of the directional solidification mold.

4. The apparatus of claim 1 , wherein one or more side walls of the directional solidification mold include a hot face refractory, and wherein a bottom of the directional solidification mold includes a conducting refractory.

5. The apparatus of claim 1 , wherein one or more side walls of the directional solidification mold include aluminum oxide, and wherein a bottom of the directional solidification mold includes silicon carbide, graphite, or a combination thereof.

6. The apparatus of claim 1 , wherein one or more side walls of the insulating layer include a different thickness, composition of material or amount of material relative to a bottom of the insulating layer.

7. The apparatus of claim 6 , wherein the insulating layer is disposed at least partially between one or more side walls of the directional solidification mold and one or more side walls of the outer jacket.

8. The apparatus of claim 1 , wherein the outer jacket includes steel, stainless steel, copper, cast iron, a refractory material, a mixture of refractory materials, or a combination thereof.

9. The apparatus of claim 1 , further comprising at least one liquid conduit, the liquid conduit sized and shaped to allow a cooling liquid to pass therethrough and transfer heat away from the directional solidification mold.

10. The apparatus of claim 9 , wherein the at least one liquid conduit is located adjacent to or within a bottom portion of the directional solidification mold, the outer jacket, or the insulating layer.

11. The apparatus of claim 1 , wherein the directional solidification mold comprises a top layer including at least one slip-plane refractory material, the top layer configured to protect the remainder of the directional solidification mold from damage when directionally solidified silicon is removed therefrom.

12. The apparatus of claim 1 , further comprising a top heater including one or more heating members, the one or more heating members including a heating element or an induction heater.

13. The apparatus of claim 12 , wherein the top heater further comprises insulation, the insulation including an insulating brick, a refractory, a mixture of refractories, an insulating board, a ceramic paper, a high temperature wool, or a mixture thereof.

14. The apparatus of claim 13 , wherein the top heater further comprises an outer jacket, wherein the insulation is disposed at least partially between the one or more heating elements and the top heater outer jacket.

15. The apparatus of claim 14 , wherein the top heater outer jacket includes stainless steel.

16. An apparatus for directional solidification of silicon, comprising:

a directional solidification mold including a refractory material,

wherein one or more side walls of the directional solidification mold include aluminum oxide;

wherein a bottom of the directional solidification mold includes silicon carbide, graphite, or a combination thereof;

a top layer, including a slip-plane refractory, the top layer configured to protect the remainder of the directional solidification mold from damage when directionally solidified silicon is removed from the mold;

an outer jacket, including steel;

an insulating layer, including insulating brick, a refractory material, a mixture of refractory materials, insulating board, ceramic paper, high temperature wool, or a mixture thereof, the insulating layer disposed at least partially between one or more side walls of the directional solidification mold and one or more side walls of the outer jacket;

a top heater, comprising:

one or more heating members, each of the heating members including a heating element or an induction heater;

wherein the heating element includes silicon carbide, molybdenum disilicide, graphite, or a combination thereof;

insulation, including insulating brick, a refractory, a mixture of refractories, insulating board, ceramic paper, high temperature wool, or a combination thereof;

an outer jacket, including stainless steel;

wherein the insulation is disposed at least partially between the one

or more heating members and the top heater outer jacket;

wherein the directional solidification mold, the outer jacket and the insulating layer are configured to be used more than twice for the directional solidification of silicon; and

wherein the insulating layer is not disposed between the bottom of the directional solidification mold and an inner bottom surface of the outer jacket, and the directional solidification mold is in contact with at least a portion of the inner bottom surface of the outer jacket.

Assignments (11)