Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
1. A method for producing a semiconductor device, comprising the steps of:
forming an adhesive layer on a semiconductor wafer by sticking an adhesive film to the semiconductor wafer;
forming an adhesive pattern by light-exposing and developing the adhesive layer; and
bonding an adherend to the semiconductor wafer via the adhesive pattern.
2. The method according to claim 1 , wherein the adhesive film is stuck to the semiconductor wafer at a temperature of 100° C. or lower.
3. The method according to claim 1 , further comprising the step of dicing a laminate of the adherend and the semiconductor wafer obtained by the bonding step.
4. The method according to claim 1 , wherein the adherend is a glass substrate.
5. The method according to claim 1 , wherein the adhesive layer is formed of a photosensitive adhesive composition having a storage modulus at 100° C., after light exposure, of 0.01 to 10 MPa, and a storage modulus at 260° C., after light exposure and heat curing, of at least 1 MPa.
6. The method according to claim 1 , wherein the adhesive layer is formed of a photosensitive adhesive composition.
7. The method according to claim 6 , wherein the photosensitive resin composition contains a polymer soluble to an alkaline aqueous solution.
8. The method according to claim 7 , wherein the polymer is soluble to tetramethyl ammonium hydride solution.
9. The method according to claim 1 , wherein said developing is conducted using an alkaline aqueous solution.