High density digital signal cross-connect system
View Patent ↗A telecommunication panel may comprise a chassis configured to receive insertable Digital Signal Cross-connect (DSX) modules and a backplane connected to the chassis. The DSX module is compact to fit into the telecommunication panel. A ratio of the number of the insertable 6-port DSX modules over the backplane surface area at least about 0.37 modules per square inch is achieved. The DSX module may include a printed circuit board and a light emitting diode (LED) light pipe on the printed circuit board to minimize the width of the DSX module. The DSX module may be inserted into the telecommunication panel horizontally or vertically so that the telecommunication panel receives a maximum number of DSX modules.
1. A telecommunication apparatus comprising:
a chassis configured to receive Digital Signal Cross-connect (DSX) modules;
a plurality of 6-port DSX modules received in the chassis; and
a backplane connected to the chassis, wherein a ratio of the number of the 6-port DSX modules to a surface area of the backplane is at least about 0.37 modules per square inch.
2. The telecommunication apparatus of claim 1 , wherein each of the 6-port DSX modules comprises:
a substantially planar module face;
a substantially planar printed circuit board connected to the module face with the printed circuit board being substantially perpendicular to the module face; and
jacks on the module face, wherein the printed circuit board is in parallel to a top surface of the chassis.
3. The telecommunication apparatus of claim 2 , wherein each of the 6-port DSX modules further comprises:
a light emitting diode (LED) on the printed circuit board;
a cover lens disposed in the module face; and
a light pipe interposed between the LED and the cover lens to transmit light from the LED to the module face.
4. The telecommunication apparatus of claim 2 , wherein each of the 6-port DSX modules further comprises a Deutsches Institut für Normung (DIN) connector mounted to the printed circuit board.
5. The telecommunication apparatus of claim 1 , wherein each of the 6-port DSX modules comprises:
a substantially planar module face; and
a set of jacks on the module face, wherein and the set of jacks is in parallel to a top surface of the chassis.
6. The telecommunication apparatus of claim 1 , wherein the chassis has a top surface comprising a slot configured to receive an insertable designation card.
7. The telecommunication apparatus of claim 6 , further comprising a designation card slidably received in the slot in the chassis.
8. The telecommunication apparatus of claim 1 , wherein the chassis has a height of about 6 inches.
9. The telecommunication apparatus of claim 8 , wherein the chassis has a width of about 23 inches.
10. The telecommunication apparatus of claim 8 , wherein the plurality of 6-port DSX modules comprises 48 modules.
11. The telecommunication apparatus of claim 1 , wherein the plurality of 6-port DSX modules comprises 24 modules.
12. A telecommunication apparatus comprising:
a chassis configured to receive 48 insertable 6-port Digital Signal Cross-connect (DSX) modules;
a backplane connected to the chassis, wherein the backplane has a height of at most about 6 inches, and
wherein a ratio of the 48 insertable 6-port DSX modules the chassis is configured to receive to a surface area of the backplane is at least about 0.37 modules per square inch.
13. The telecommunication apparatus of claim 12 , wherein the backplane has a width of at most about 23 inches.
14. The telecommunication apparatus of claim 12 , wherein the chassis has 6 columns and each column is configured to receive 8 insertable 6-port DSX modules.
15. The telecommunication apparatus of 12 , further comprising a plurality of 6-port DSX modules, each of the 6-port DSX modules comprising:
a substantially planar module face;
a substantially planar printed circuit board connected to the module face with the printed circuit board being substantially perpendicular to the module face; and
jacks on the module face, wherein the printed circuit board is in parallel to a top surface of the chassis.
16. The telecommunication apparatus of claim 15 , wherein each of the 6-port DSX modules further comprises:
a light emitting diode (LED) on the printed circuit board;
a cover lens disposed in the module face; and
a light pipe interposed between the LED and the cover lens to transmit light from the LED to the module face.
17. The telecommunication apparatus of claim 12 , further comprising a plurality of 6-port DSX modules, each of the 6-port DSX modules comprising:
a substantially planar module face; and
a set of jacks on the module face, wherein and the set of jacks is in parallel to a top surface of the chassis.
18. The telecommunication apparatus of claim 12 , wherein the chassis has a top surface comprising a slot configured to receive an insertable designation card.
19. The telecommunication apparatus of claim 18 , further comprising a designation card slidably received in the slot in the chassis.
20. A telecommunication apparatus comprising:
a chassis configured to receive twenty four 6-port Digital Signal Cross-connect (DSX) modules; and
a backplane connected to the chassis, wherein a ratio of the number of the 6-port DSX modules to a surface area of the backplane is at least about 0.39 modules per square inch.
21. The telecommunication apparatus of claim 20 , wherein each of the 6-port DSX modules comprises:
a substantially planar module face;
a substantially planar printed circuit board connected to the module face with the printed circuit board being substantially perpendicular to the module face; and
jacks on the module face, wherein the printed circuit board is perpendicular to a top surface of the chassis.
22. The telecommunication apparatus of claim 21 , wherein each of the 6-port DSX modules further comprises a Deutsches Institut für Normung (DIN) connector mounted to the printed circuit board.
23. The telecommunication apparatus of claim 21 , wherein each of the 6-port DSX modules further comprises:
a light emitting diode (LED) on the printed circuit board;
a cover lens disposed in the module face; and
a light pipe interposed between the LED and the cover lens to transmit light from the LED to the module face.
24. The telecommunication apparatus of claim 20 , wherein each of the 6-port DSX modules comprises:
a substantially planar module face; and
a set of jacks on the module face, wherein and the set of jacks is perpendicular to a top surface of the chassis.
25. The telecommunication apparatus of claim 20 , further comprising a designation card over the top of a fastener on the module face.
26. The telecommunication apparatus of claim 20 , wherein the chassis has a height of about 3.5 inches.
27. The telecommunication apparatus of claim 26 , wherein the chassis has a width of about 19 inches.