Electromagnetic interference containment structures
View Patent ↗In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
1. An optoelectronic module, comprising:
a body defining a cavity within which one or more components are disposed, the body connected to chassis ground;
a signal ground; and
an optical subassembly disposed in the body cavity and having one or more components connected to the signal ground, the optical subassembly comprising:
a header assembly within which one or more components that generate electromagnetic interference emissions are housed, the header assembly including an optical aperture;
a housing including a port and a barrel, the port defining a fiber receptacle and the barrel defining a cavity that at least partially receives the header assembly;
an integral lens disposed within the cavity defined by the barrel; and
a containment structure, connected to signal ground and to the header assembly, that at least partially shields the electromagnetic interference emissions within the optical subassembly, the containment structure defining a containment aperture that is smaller than the optical aperture, wherein:
the one or more containment structures further comprise a containment disk configured to be connected to the signal ground;
the containment disk is disposed between the integral lens and the header assembly; and
the containment disk defines a containment disk aperture that is smaller than the optical aperture.
2. The optoelectronic module of claim 1 , wherein the containment structure further comprises a metallization layer substantially covering an exterior surface of the housing and a portion of an interior surface of the barrel.
3. The optoelectronic module of claim 2 , wherein the metallization layer is connected to chassis ground.
4. The optoelectronic module of claim 2 , wherein the metallization layer does not cover the integral lens.
5. The optoelectronic module of claim 1 , wherein the containment disk defining the containment aperture that is substantially aligned with the optical aperture.
6. The optoelectronic module of claim 1 , wherein a conductive epoxy attaches the containment disk to the header assembly and connects the containment disk to signal ground, and wherein the containment disk is not connected to the metallization layer.
7. The optoelectronic module of claim 6 , wherein the conductive epoxy comprises silver epoxy.
8. The optoelectronic module of claim 2 , wherein the containment structures further comprise a port shield disposed in the barrel cavity, the port shield defining a port shield aperture that is smaller than and substantially aligned with the optical aperture.
9. The optoelectronic module of claim 8 , wherein the port shield has a funnel shape, including a wide end attached to a portion of the metallization layer within the barrel cavity and a narrow end defining the port shield aperture, het port shield being connected to chassis ground via the metallization layer.
10. The optoelectronic module of claim 9 , wherein the wide end of the port shield is attached to the portion of the metallization layer by mechanical interference or conductive epoxy.
11. The optoelectronic module of claim 1 , wherein the containment structure comprises a containment layer disposed on a window of the header assembly, the containment layer defining the optical aperture.
12. The optoelectronic module of claim 11 , wherein the containment layer comprises a metal coating and is connected to signal ground.
13. An optoelectronic module, comprising:
a body defining a cavity within which one or more components are disposed, the body connected to chassis ground;
a signal ground; and
an optical subassembly disposed in the body cavity and having one or more components connected to signal ground, the optical subassembly comprising:
a header assembly within which one or more components that generate electromagnetic interference emissions are housed, the header assembly including an optical aperture;
a housing including a port and a barrel, the port defining a fiber receptacle and the barrel defining a cavity that at least partially receives the header assembly;
an integral lens disposed within the cavity defined by the barrel; and
a containment structure, connected to a chassis ground, that at least partially shields the electromagnetic interference emissions within the optical subassembly, the containment structure defining a containment aperture that is smaller than the optical aperture, wherein:
the containment structure comprises a metallization layer substantially covering an exterior surface of the house and an interior radial surface of the cavity, the metallization layer configured to be connected to chassis ground;
the containment structure further comprises a port shield disposed between the integral lens and the header assembly, the port shield defining a port shield aperture that is smaller than and substantially aligned with the optical aperture; and
the port shield being connected to the metallization layer and a chassis ground via the metallization layer; wherein the port shield has a funnel shape, including a wide end attached to a portion of the metallization layer within the barrel cavity and a narrow end defining the port shield aperture.
14. The optoelectronic module of claim 13 , wherein the wide end of the port shield is attached to the portion of the metallization layer by mechanical interference or conductive epoxy.