Method forming a semiconductor light emitting device with perforations formed within
View Patent ↗A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.
1. A method for manufacturing a circuit board for a light emitting diode package, comprising:
perforating at least two through holes in a board body made of a thermally conductive metal;
forming insulating oxidation layers in predetermined surface areas of the board body, which are adjacent to upper and lower ends of the through holes, and inner wall surfaces of the through holes, respectively;
forming first conductive patterns on the insulating oxidation layers to be electrically insulated from the board body;
forming second conductive patterns on the board body between the first conductive patterns to be disposed at a predetermined distance therefrom, so that the second conductive patterns are electrically isolated from the first conductive patterns; and
cutting the board body in such a fashion that the first conductive patterns are disposed at opposing edges of the board body and the second conductive patterns are located in a central portion of the board body.
2. The method according to claim 1 , wherein the through holes are formed in at least two rows in the perforating step, and
each of the insulating oxidation layers is formed to surround the through holes in each of the rows in the step of forming the insulating oxidation layers.
3. The method according to claim 1 , wherein the insulating oxidation layers are formed by anodizing.
4. The method according to claim 1 , wherein the board body is made of one selected from a group consisting of aluminum, titanium, tantal, magnesium, halfnium and alloys thereof.
5. A method for manufacturing a light emitting diode package, comprising:
perforating at least two through holes in a board body made of a thermally conductive metal;
forming insulating oxidation layers in predetermined areas of the board body, which are adjacent to upper and lower ends of the through holes, and inner wall surfaces of the through holes, respectively;
forming first conductive patterns on the insulating oxidation layers to be electrically insulated from the board body,
forming second conductive patterns on the board body between the first conductive patterns to be disposed at a predetermined distance therefrom, so that the second conductive patterns are electrically isolated from the first conductive patterns;
disposing light emitting diodes on the second conductive patterns between the through holes, respectively, and electrically connecting the light emitting diodes with the first conductive patterns;
coating a transparent resin to cover the light emitting diodes; and
cutting the board body to separate the light emitting diodes into each unit.
6. The method according to claim 5 , wherein the through holes are formed in at least two rows in the perforating step,
each of the insulating oxidation layers is formed to surround the through holes in each of the rows in the step of forming the insulating oxidation layers, and
each of the light emitting diodes is disposed between two of the through holes in different rows in the step of disposing the light emitting diodes.
7. The method according to claim 5 , wherein the transparent resin is formed of a strip to entirely cover the rows of the light emitting diodes.
8. The method according to claim 5 , wherein the insulating oxidation layers are formed by anodizing.
9. The method according to claim 5 , wherein the board body is made of one selected from a group consisting of aluminum, titanium, tantal, magnesium, halfnium and alloys thereof.