Method of fabricating micrometer scale components
View Patent ↗A method for manufacturing micrometer scale components comprises depositing a first metal on a substrate, depositing a second metal in a mold, and alloying the first and second metals together to form the component.
1. A method for forming a micrometer scale component, comprising:
providing a mold;
disposing a first coating of a release material on the entire surface of the mold, the first coating comprising a single layer of material;
disposing a second coating of a first metal on a substrate;
disposing a second metal on the coated mold;
alloying the second metal with the first metal to form a micrometer scale component; and
removing the component from the mold and release material;
wherein the release material comprises a third metal;
wherein the step of alloying the second metal with the first metal comprises alloying the second metal, the first metal, and the third metal, and wherein the first coating of the release layer comprising the third metal has a thickness such that, after the step of alloying, the micrometer scale component comprises a substantially pure layer of the third metal at a surface of the micrometer scale component.
2. The method of claim 1 , wherein the first metal and the third metal are the same or are from the same alloy system.
3. The method of claim 1 , wherein the second metal is wettable with the first metal and the third metal.
4. The method of claim 3 , wherein the first metal and the second metal are selected such that the alloy of the first metal and the second metal has a higher liquidus temperature than the second metal.
5. The method of claim 3 , wherein the first metal and the second metal comprise In, Sn, Ag, Au, Ge, Ga, Bi, Cu, or Pb.
6. The method of claim 4 , wherein the step of alloying the second metal with the first metal further comprises alloying the second metal with the first metal and the third metal.
7. The method of claim 6 , wherein the step of alloying the second metal with the first metal and the third metal comprises reflow soldering.
8. The method of claim 7 , further comprising moving the substrate to a predetermined distance from the mold during the step of alloying.
9. The method of claim 1 , wherein the micrometer scale component comprises a catoptric structure.