MULTILAYER BUILD PROCESSSES AND DEVICES THEREOF
A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.
1 . A process comprising:
a. forming a seed layer on a substrate;
b. modifying the seed layer by at least one:
i. selectively applying a temporary patterned passivation layer; and
ii. selectively removing the seed layer;
c. selectively forming an image-wise mold layer over the substrate to expose at least one conductive area;
d. electrodepositing a first material on the exposed conductive area.
2 . The process according to claim 1 , wherein the substrate comprises an image-wise mold layer including at least one of conductive and insulative material.
3 . The process according to claim 2 , wherein the insulative material comprises at least one of photoresist and dielectric material.
4 . The process according to claim 1 , wherein selectively applying the temporary patterned passivation layer comprises depositing a layer of passivation material on the seed layer and patterning the passivation material to expose a portion of the seed layer.
5 . The process according to claim 4 , wherein the exposed conductive area is the exposed portion of the seed layer.
6 . The process according to claim 1 , wherein selectively applying the temporary patterned passivation layer comprises selectively placing passivation material on the seed layer to block a portion of the seed layer.
7 . The process according to claim 5 , wherein the passivation layer is substantially thinner relative to the image-wise mold layer.
8 . The process according to claim 1 , wherein selectively removing the seed layer exposes a non-conductive portion of the substrate.
9 . The process according to claim 8 , wherein the exposed conductive area is the remaining portion of the seed layer.
10 . The process according to claim 1 , comprising:
a. remove the temporary patterned passivation layer to provide another conducive area; and
f. forming a second material on the other conductive area.
11 . The process according to claim 10 , wherein at least one of the first material and the second material is formed by at least one of:
a. an electrodeposition process;
h. a transfer bonding process;
c. a dispensing process;
c. a lamination process.
d. a vapor deposition process
e. a screen printing process;
f. a squeegee process; and
g. a pick-and-place process.
12 . The process according to claim 1 , comprising planarizing at least the first material.
13 . A multi-layer structure formed by the process according to claim 1 .
14 . A process comprising:
a. selectively applying a temporary patterned passivation layer on a conductive substrate;
c. selectively forming an image-wise mold layer over the substrate to expose at least one conductive area;
d. forming a first material on at least one of the exposed conductive areas;
e. removing the temporary patterned passivation layer to provide another conducive area; and
f. forming a second material on the other conductive area.
15 . The process according to claim 14 , wherein at least one of the first material and the second material is formed by at least one of:
a. an electrodeposition process;
b. a transfer bonding process;
c. a dispensing process;
c. a lamination process.
d. a vapor deposition process
e. a screen printing process;
f. a squeegee process; and
g. a pick-and-place process.
16 . The process according to claim 14 , comprising placing a blocking material on at least one of the at least one exposed conductive areas.
17 . The process according to claim 16 , wherein the blocking material comprises ceramic material.
18 . A multi-layer structure formed by the process according to claim 14 .
19 . A process comprising:
a. forming a sacrificial image-wise mold layer on a substrate layer exposing at least one portion of the substrate layer;
b. selectively placing at least a first material in at least one of the at least one exposed portion of the substrate layer; and
c. forming at least a second material over the substrate layer; and
d. removing the sacrificial image-wise mold layer.
20 . The process according to claim 19 , wherein selectively placing the at least first material comprises a transfer bonding process, wherein:
a. at least the at least first material is affixed to a carrier substrate;
b. at least the at least first material is patterned;
c. at least the patterned first material is affixed to the substrate layer; and
d. the carrier substrate is released.
21 . The process according to claim 19 , wherein selectively placing the at least first material comprises a lamination process, wherein the first material is patterned at least one of before and after it is laminated to the substrate layer.
22 . The process according to claim 19 , wherein selectively placing the at least first material comprises a transfer bonding process, wherein the at least the first material is supported by a support lattice to suspend the first material before it is laminated and then the first material is laminated to the substrate layer.
23 . The process of claim 19 , wherein selectively placing the at least first material comprises a dispensing process, wherein the first material is selectively dispensed.
24 . The process according to claim 19 , wherein the first material and the second material are at least one of:
a. spaced apart from each other; and
b. adjacent each other.
25 . The process according to claim 19 , wherein the first material is one of a non-conductive and conductive material.
26 . A multi-layer structure formed by the process according to claim 19 .