Thin film transistor and manufacturing method of the same
View Patent ↗To achieve TFT having a high light-resistance characteristic with a suppressed light leak current at low cost by simplifying the manufacturing processes. The TFT basically includes: a light-shielding film formed on a glass substrate that serves as an insulating substrate; an insulating film formed on the light-shielding film; a semiconductor film formed on the insulating film; and a gate insulating film formed on the semiconductor film. Each layer of a laminate that is configured with three layers of the light-shielding film, the insulating film, and the semiconductor film is patterned simultaneously. Further, each layer of the laminate is configured with silicon or a material containing silicon.
1. A method for manufacturing a thin film transistor, the transistor including:
a light-shielding film formed on an insulating substrate;
an insulating film formed on the light-shielding film;
a semiconductor film formed on the insulating film;
a gate insulating film formed on the semiconductor film,
wherein each layer of a laminate configured with a plurality of layers including the light-shielding film, the insulating film, and the semiconductor film is made of silicon or a material containing silicon, a sum of film thickness of the light-shielding film and the insulating film is equal to or less than a film thickness of the semiconductor film, a film thickness of the laminate is equal to or less than a film thickness of the gate insulating film, and the light-shielding film has light-shielding performance for wavelengths of 400 nm to 500 nm,
the method for manufacturing the thin film transistor comprising:
forming each layer of the laminate on the insulating substrate continuously in a same film-forming device; and then
simultaneously patterning the each layer of the laminate.
2. The method for manufacturing the thin film transistor as claimed in claim 1 , wherein the laminate has side faces that are in a bilateral symmetry in a sectional shape of a film-thickness direction.
3. The method for manufacturing the thin film transistor as claimed in claim 1 , wherein the laminate has a side face that is patterned in a tapered form in such a manner that the sectional shape becomes smaller towards the upper side in the film-thickness direction.
4. The method for manufacturing the thin film transistor as claimed in claim 1 , wherein the laminate has a side face that is patterned in a step form in such a manner that the sectional shape becomes smaller towards the upper side in the film-thickness direction.
5. The method for manufacturing the thin film transistor as claimed in claim 1 , wherein the laminate has a side face that is patterned in a tapered form and in a step form in such a manner that the sectional shape becomes smaller towards the upper side in the film-thickness direction.
6. The method for manufacturing the thin film transistor as claimed in claim 1 wherein the light-shielding film has a film thickness with which an amount of transmitting light is reduced by half for a wavelength of about 450 nm.
7. The method for manufacturing the thin film transistor as claimed in claim 1 , wherein the material containing silicon is a material having silicon as a main component.
8. The method for manufacturing the thin film transistor as claimed in claim 7 , wherein the semiconductor film is made of polycrystalline silicon, and the light-shielding film is made of polycrystalline silicon having a film thickness of 50 nm or more.
9. The method for manufacturing the thin film transistor as claimed in claim 7 , wherein the semiconductor film is made of polycrystalline silicon, and the light-shielding film is made of amorphous silicon having a film thickness of 10 nm to 20 nm.