Slotted configuration for optimized placement of micro-components using adhesive bonding
View Patent ↗An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and “shape” of an adhesive “dot” so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (“channels”) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.
1. An arrangement comprising:
a substrate comprising a plurality of parallel-disposed slots formed in a surface of the substrate, the plurality of slots holding a prescribed volume of dispensed liquid adhesive material utilized to bond a micro-component to the substrate,
wherein the substrate comprises at least one channel disposed in the surface adjacent to the plurality of slots, the at least one channel is arranged on the substrate to surround at least two sides of the periphery of the plurality of slots; and
wherein the substrate comprises a semiconductor layer and an insulation layer physically contacting the semiconductor layer, wherein the plurality of slots extends through at least a portion of the insulation layer and respective depths of the plurality of slots are between a surface of the insulation layer and a surface of the semiconductor layer contacting the insulation layer, and wherein the at least one channel extends from the surface of the insulation layer, through the insulation layer, and through at least a portion of the semiconductor layer.
2. The arrangement as defined in claim 1 wherein the plurality of slots are configured to mimic the topology of the surface of the micro-component being bonded to the substrate, the configuration of the plurality of slots providing self-centering of the microcomponent with respect to the plurality of slots upon bonding thereto.
3. The arrangement of claim 1 wherein each slot of the plurality of slots has essentially the same length.
4. The arrangement of claim 1 wherein each slot of the plurality of slots is formed to essentially the same depth between the surface of the insulation layer and the surface of the semiconductor layer.
5. The arrangement of claim 1 wherein the plurality of slots are separated by essentially the same spacing.
6. The arrangement as defined in claim 1 wherein the arrangement further comprises
at least one heater element disposed in association with a slot of the plurality of parallel-disposed slots to provide local heating of the adhesive material disposed on the associated slot; and
means for controlling the turning “on” and “off' of the at least one heater element.
7. The arrangement as defined in claim 6 where the at least one heater element is disposed adjacent to an associated slot.
8. The arrangement as defined in claim 6 wherein the at least one heater element is embedded within an associated slot.
9. The arrangement as defined in claim 6 wherein the at least one heater element comprises a resistive element and the means for controlling the turning “on” and “off' comprises a switch for passing current through the resistive element.
10. The arrangement as defined in claim 9 wherein the resistive element is comprised of a material selected from the group consisting of: silicon, polysilicon, silicides, metals.
11. The arrangement as defined in claim 1 wherein the substrate comprises an electrical integrated circuit substrate.
12. The arrangement as defined in claim 1 wherein the substrate comprises an optical system substrate.
13. The arrangement as defined in claim 12 wherein the optical system substrate comprises a silicon-on-insulator (SOI) substrate.
14. The arrangement as defined in claim 1 wherein the substrate comprises an opto-electronic system substrate.
15. An arrangement comprising:
a substrate comprising a plurality of parallel-disposed slots formed in a surface of the substrate, the plurality of slots holding a prescribed volume of dispensed liquid adhesive material utilized to bond a micro-component to the substrate,
wherein the substrate comprises at least one channel disposed in the surface adjacent to the plurality of slots, the at least one channel is arranged on the substrate to surround at least two sides of the periphery of the plurality of slots; and
wherein the substrate comprises a semiconductor layer and an insulation layer disposed on the semiconductor layer, wherein respective depths of the plurality of slots is between a surface of the insulation layer and a surface of the semiconductor layer contacting the insulation layer, and wherein the at least one channel extends from the surface of the insulation layer to below the surface of the semiconductor layer, the at least one channel is defined by opposing surfaces that extend along an entire length of the at least one channel.