Manufacturing method of semiconductor device, semiconductor device, and method of printing on semiconductor wafer
View Patent ↗A method of printing on a semiconductor wafer, a manufacturing method of a semiconductor device, and a semiconductor device which enable to easily perform positioning in the direction perpendicular to the top of the wafer and to easily identify the type of the wafer. The manufacturing method includes preparing a semiconductor wafer having a structure in which an element forming film is stacked on the top of an insulative transparent substrate, forming a light reflection film to reflect light for positioning on the bottom of the transparent substrate, irradiating a laser from the side at which the element forming film is disposed so as to form printed letters at the light reflection film, forming a semiconductor element at the element forming film, forming an interlayer dielectric film to cover the element forming film and the semiconductor element, forming a contact wire, and forming a metal wire on the interlayer dielectric film.
1. A manufacturing method of a semiconductor device, comprising:
preparing a semiconductor wafer having a structure in which an element forming film is stacked on a top of an insulative transparent substrate;
forming a light reflection film to reflect light for positioning in a direction perpendicular to a top of the semiconductor wafer on a bottom of the transparent substrate;
irradiating a laser from a side at which the element forming film is disposed so as to form printed letters at the light reflection film;
forming a semiconductor element at the element forming film;
forming an interlayer dielectric film to cover the element forming film and the semiconductor element;
forming a contact wire extending through the interlayer dielectric film such that the contact wire is electrically connected to the semiconductor element; and
forming a metal wire on the interlayer dielectric film such that the metal wire is connected to the contact wire.
2. The manufacturing method according to claim 1 , wherein the step of forming the printed letters comprises irradiating the laser while holding the light reflection film.
3. The manufacturing method according to claim 1 , wherein the laser is transmitted through the element forming film and the transparent substrate so as to remove only the light reflection film.
4. The manufacturing method according to claim 2 , wherein the laser is transmitted through the element forming film and the transparent substrate so as to remove only the light reflection film.
5. The manufacturing method according to claim 1 , wherein the transparent substrate is formed of sapphire or quartz.
6. The manufacturing method according to claim 2 , wherein the transparent substrate is formed of sapphire or quartz.
7. The manufacturing method according to claim 3 , wherein the transparent substrate is formed of sapphire or quartz.
8. A semiconductor device comprising:
a semiconductor wafer having a structure in which an element forming film is stacked on a top of an insulative transparent substrate; and
a light reflection film formed on a bottom of the transparent substrate so as to reflect light for positioning in a direction perpendicular to a top of the semiconductor wafer, wherein
the light reflection film has a printing region at which printed letters for semiconductor wafer identification are provided.
9. The semiconductor device according to claim 8 , wherein the printed letters comprise through holes extending through only the transparent substrate.
10. The semiconductor device according to claim 9 , wherein the printed letters provided at the printing region indicate process history, place of production, and properties of the semiconductor wafer.
11. The semiconductor device according to claim 9 , further comprising at least one semiconductor element formed at the element forming film.
12. The semiconductor device according to claim 10 , further comprising at least one semiconductor element formed at the element forming film.
13. A method of printing on a semiconductor wafer having a structure in which a light reflection film, an insulative transparent substrate, and a element forming film are sequentially stacked, the printing method comprising
irradiating a laser from a side at which the element forming film is disposed so as to form printed letters at the light reflection film.
14. The printing method according to claim 13 , wherein the step of forming the printed letters is performed while holding the light reflection film.
15. The printing method according to claim 13 , wherein the laser is transmitted through the element forming film and the transparent substrate so as to remove only the light reflection film.
16. The printing method according to claim 14 , wherein the laser is transmitted through the element forming film and the transparent substrate so as to remove only the light reflection film.
17. The printing method according to claim 13 , wherein the transparent substrate is formed of sapphire or quartz.
18. The printing method according to claim 14 , wherein the transparent substrate is formed of sapphire or quartz.
19. The printing method according to claim 15 , wherein the transparent substrate is formed of sapphire or quartz.
20. The printing method according to claim 16 , wherein the transparent substrate is formed of sapphire or quartz.