Stacked inductor-electronic package assembly and technique for manufacturing same
View Patent ↗An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
1. A power supply, comprising:
a power-supply module having a side;
a first inductor disposed over, and facing, the side, and electrically coupled to the power-supply module; and wherein,
the power-supply module includes electrically conductive holes that are exposed only on the side of the power-supply module facing the first inductor; and
the first inductor includes electrically conductive leads that are each disposed in, and attached to a surface defining, a respective one of the holes such that each lead electrically couples the first inductor to the power-supply module, and attaches the first inductor to the power-supply module.
2. The power supply of claim 1 wherein the power-supply module includes a printed circuit board, an integrated circuit chip, a resistor, a capacitor, and a transistor.
3. The power supply of claim 1 wherein the inductor includes a coupled inductor.
4. The power supply of claim 1 wherein the inductor includes a choke inductor.
5. The power supply of claim 1 wherein the inductor includes an uncoupled inductor.
6. The power supply of claim 1 wherein:
the power-supply module includes components; and
an encapsulating material fills a space between the components.
7. The power supply of claim 1 , further comprising a second inductor disposed over, and facing, the side of the power-supply module, and including electrically conductive leads that are each disposed in, and attached to a surface defining, a respective one of the holes such that each lead of the second conductor electrically couples the second inductor to the power-supply module, and attaches the second inductor to the power-supply module.
8. A power supply, comprising:
a power-supply module having sides, a top, and a bottom;
a first inductor disposed over, and facing, the top, and electrically coupled to the power-supply module; and wherein:
the power-supply module includes a plurality of leads each extruding outwards from the bottom and a respective side of the module and each having a reverse J-bend configuration on the top of the module; and
the inductor includes terminals or solder pads that are respectively attached to at least some of the reverse J-bend configurations on the top of the module such that the at least some of the reverse J-bend configurations electrically couple the inductor to the power-supply module and attach the inductor to the top of the power-supply module.
9. The power supply of claim 8 , further comprising a second inductor disposed over, and facing, the top of the power-supply module, and including terminals or solder pads that are respectively attached to others of the reverse J-bend configurations on the top of the module such that the other reverse J-bend configurations electrically couple the second inductor to the power-supply module and attach the second inductor to the top of the power-supply module.
10. A circuit, comprising:
a circuit module including a package having a side;
a first inductor disposed over, and facing, the side, and electrically coupled to the module;
wherein the circuit module includes electrically conductive holes that are exposed only on the side of the package facing the first inductor; and
wherein the inductor includes electrically conductive leads that are each disposed in, and attached to a surface defining, a respective one of the holes such that each lead electrically couples the inductor to the circuit module and attaches the inductor to the circuit module.
11. The circuit of claim 10 , further comprising a second inductor disposed over, and facing, the side of the circuit module, and including electrically conductive leads that are each disposed in, and attached to a surface defining, a respective one of the holes such that each lead of the second inductor electrically couples the second inductor to the circuit module, and attaches the second inductor to the circuit module.
12. A system, comprising:
a module including a first integrated circuit, sides, a top, and a bottom, and a pair of leads each extruding outwards from the bottom and a respective side of the module and having a portion that is bent over the top of the module;
an inductor disposed over, and facing, the top of the module, and including terminals or solder pads that are respectively attached to the portions of at least some of the leads that are bent over the top of the module such that the portions of the at least some of the leads that are bent over the top of the module electrically couple the inductor to the module and detachably secure the inductor to the top of the module; and
a second integrated circuit coupled to the first integrated circuit.
13. The system of claim 12 wherein:
the module comprises a power-supply module; and
the first integrated circuit comprises a power supply controller.
14. The system of claim 12 wherein the inductor is coupled to the first integrated circuit.
15. The system of claim 12 wherein the second integrated circuit is disposed within the module.
16. The system of claim 12 wherein the first and second integrated circuits are disposed on a same die.
17. The system of claim 12 wherein the first and second integrated circuits are disposed on respective dies.
18. The system of claim 12 wherein the second integrated circuit comprises a processor.
19. The system of claim 12 wherein:
the module is operable to generate a supply voltage on an output node; and
the second integrated circuit includes a supply node coupled to the output node of the module.
20. The system of claim 12 , further comprising a second inductor disposed over, and facing, the top of the module, and including terminals or solder pads that are respectively attached to the portions of others of the leads that are bent over the top of the module such that the portions of the others of the leads that are bent over the top of the module electrically couple the second inductor to the module and detachably secure the second inductor to the top of the module.
21. A power supply, comprising:
a power-supply module having a side and including electronic circuitry;
a first inductor disposed over, and facing, the side, and electrically coupled to the power-supply module; and wherein,
the power-supply module includes electrically conductive holes that are exposed only on the side of the power-supply module facing the first inductor; and
the first inductor includes electrically conductive leads that are each disposed in, and attached to a surface defining, a respective one of the holes such that each lead electrically couples the first inductor to the electronic circuitry in the power-supply module, and attaches the first inductor to the power-supply module.
22. The power supply of claim 21 , further comprising a second inductor disposed over, and facing, the side of the power-supply module, and electrically coupled to the power-supply module, the second inductor including electrically conductive leads that are each disposed in, and attached to a surface defining, a respective one of the holes such that each lead of the second conductor electrically couples the second inductor to the electronic circuitry in the power-supply module, and attaches the second inductor to the power-supply module.
23. The power supply of claim 21 , further comprising an electronic component coupled to the power-supply module.
24. The power supply of claim 21 , further comprising a capacitor coupled to the power-supply module.