Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
View Patent ↗A substrate includes an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film. A wiring pattern is adhered to the first surface of the insulating film by an adhesive material. A first portion of the wiring pattern is formed over the penetrating hole, and a part of the adhesive material is formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole. An external electrode contacts the first portion of the wiring pattern and projects through the penetrating hole and extends beyond the second surface of the insulating film.
1. A substrate comprising:
an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film;
a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on a first part of an internal wall surface so as not to stop up the penetrating hole, the adhesive material not being in contact with a second part of the internal wall surface, the internal wall surface forming the penetrating hole; and
an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film, a first portion of the external electrode being in contact with a first part of a surface of the part of the adhesive material, the first part of the surface of the part of the adhesive material facing a first opening of the penetrating hole in the second surface of the insulating film, the first portion of the external electrode positioned within the penetrating hole.
2. The substrate as defined in claim 1 , wherein the adhesive material is an adhesive tape.
3. The substrate as defined in claim 1 , further comprising an anisotropic conductive material having conductive particles dispersed in an adhesive.
4. A semiconductor device comprising:
an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film;
a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on a first part of an internal wall surface so as not to stop up the penetrating hole, the adhesive material not being in contact with a second part of the internal wall surface, the internal wall surface forming the penetrating hole;
an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film, a first portion of the external electrode being in contact with a first part of a surface of the part of the adhesive material, the first part of the surface of the part of the adhesive material facing a first opening of the penetrating hole in the second surface of the insulating film, the first portion of the external electrode positioned within the penetrating hole; and
a semiconductor chip that has an electrode electrically connected to the wiring pattern, the semiconductor chip being mounted to the first surface of the insulating film.
5. The semiconductor device defined in claim 4 , wherein the adhesive material is an adhesive tape.
6. The semiconductor device defined in claim 4 , an outline form of the insulating film being larger than an outline form of the semiconductor chip.